5SGXEA3H1F35C1G

The 5SGXEA3H1F35C1G is an Intel Stratix V GX field programmable gate array (FPGA) supplied in a 1152-ball FCBGA package. It delivers large logic capacity and embedded memory in a surface-mount, commercial-grade device suited for high-density programmable logic designs.

As a Stratix V GX family device, the part is offered with Stratix V series electrical characteristics and transceiver-grade options documented for the family in the device datasheet. This unit provides a combination of logic resources, on-chip RAM, and I/O density for complex FPGA implementations.

Key Features

• Core Capacity: 340,000 logic elements (cells) for implementing large, complex programmable logic designs.
• Embedded Memory: Approximately 19.46 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
• I/O Density: 432 user I/O pins, enabling broad connectivity to peripherals, memory interfaces, and board-level fabrics.
• Package & Mounting: 1152-ball BGA (1152-FBGA, 35 × 35) in an FCBGA form factor; surface-mount package suitable for high-density PCB assembly.
• Power Supply: Core voltage supply range of 870 mV to 930 mV, compatible with low-voltage FPGA core domains.
• Operating Range: Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance: RoHS-compliant manufacturing status.

Unique Advantages

• High logic capacity: 340,000 logic elements provide the resource headroom required for large, multi-function FPGA implementations without partitioning across multiple devices.
• Substantial on-chip RAM: Approximately 19.46 Mbits of embedded memory reduces dependency on external memory for many buffering and caching needs, simplifying board design.
• Significant I/O count: 432 I/O pins allow direct interfacing to a wide range of external devices and high-pin-count peripherals.
• Compact, manufacturable package: 1152-ball FCBGA (35 × 35) provides a high lead-count solution in a compact footprint suitable for modern PCB layouts and automated surface-mount assembly.
• Commercial grade availability: Designed for commercial temperature operation (0 °C to 85 °C) and RoHS compliance for regulatory alignment in mainstream applications.

Why Choose 5SGXEA3H1F35C1G?

The 5SGXEA3H1F35C1G delivers a combination of large logic capacity, meaningful on-chip RAM, and high I/O density in a single commercial-grade Stratix V GX device. It is targeted at designs that require substantial programmable logic resources and embedded memory while maintaining a compact BGA package and surface-mount compatibility.

This part is appropriate for engineering teams and procurement seeking a high-capacity FPGA with clear, verifiable electrical and packaging specifications—providing scalability within designs that leverage the Stratix V family datasheet characteristics and Intel product support documentation.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGXEA3H1F35C1G. Include your desired quantities and any required delivery timelines to expedite a response.