5SGXEA3H1F35C2LG

The 5SGXEA3H1F35C2LG is a Stratix® V GX field-programmable gate array (FPGA) in a 1152‑BBGA (FCBGA) package designed for high-density programmable logic and embedded memory. This commercial-grade device combines a large logic fabric, substantial on-chip RAM, and a high I/O count to support complex, parallel processing and I/O-intensive designs.

Engineered for applications that require significant logic capacity and integrated memory, the device delivers 340,000 logic elements, approximately 19.46 Mbits of embedded memory, and 432 user I/Os while operating within a core supply range of 820 mV to 880 mV.

Key Features

• Logic Capacity  340,000 logic elements to implement large-scale, highly parallel digital logic and custom IP.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM for buffering, LUT memory, and state storage within the FPGA fabric.
• I/O Density  432 user I/Os to support wide external interfaces and complex board-level connectivity.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35×35) with surface-mount mounting for high-density PCB integration.
• Power / Core Voltage  Core supply operating range of 820 mV to 880 mV to match system power rails and design targets.
• Operating Grade & Temperature  Commercial-grade device rated for 0 °C to 85 °C operation.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density data processing  Leverage the 340,000 logic elements and substantial embedded RAM for parallel data-paths, packet processing, and compute-accelerated tasks.
• Telecom and Networking  High I/O count and large logic fabric enable complex interface handling and protocol processing in network appliances and switches.
• Signal Processing  Use the on-chip memory and dense logic resources for real-time DSP algorithms and multi-channel processing pipelines.
• Prototyping and Custom Hardware  A large, programmable fabric and abundant I/Os make the device suitable for system prototyping and custom accelerator development.

Unique Advantages

• High logic density: 340,000 logic elements provide the capacity to implement complex SoC-style designs and multiple custom IP cores on a single device.
• Significant on-chip RAM: Approximately 19.46 Mbits of embedded memory reduces dependence on external RAM for many buffering and stateful functions.
• Extensive I/O resources: 432 user I/Os simplify integration with high-pin-count peripherals and multi-lane interfaces without excessive board-level multiplexing.
• Compact system footprint: 1152‑BBGA (35×35) FCBGA package supports a dense PCB layout while maintaining high connectivity and thermal considerations for surface-mount designs.
• Commercial temperature support: Rated for 0 °C to 85 °C operation to meet standard commercial application requirements.
• Regulatory compliance: RoHS compliant for environmentally conscious designs and global sourcing.

Why Choose 5SGXEA3H1F35C2LG?

The 5SGXEA3H1F35C2LG is positioned for designers who require a large, flexible FPGA fabric with substantial embedded memory and high I/O capability in a compact, surface-mount package. Its combination of 340,000 logic elements, approximately 19.46 Mbits of on-chip RAM, and 432 I/Os makes it well suited for demanding data-path, signal-processing, and interface-intensive applications within the commercial temperature range.

Choosing this Stratix® V GX device provides a scalable hardware platform for advanced prototypes and production systems where logic density, integrated memory, and I/O count directly impact design simplicity and board-level integration.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXEA3H1F35C2LG for your next design.