5SGXEA4K3F40I3LG

The 5SGXEA4K3F40I3LG is an Intel Stratix® V GX family field programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It provides a high density of logic and on-chip memory with extensive I/O in an industrial-grade package for demanding embedded and system-level designs.

As a member of the Stratix V GX series, this device combines a large logic element count, substantial embedded RAM, and GX-class transceiver support to address applications that require high integration and robust temperature and power operating ranges.

Key Features

• Core capacity — 420,000 logic elements for high-density digital implementation and complex system integration.
• Embedded memory — Total on-chip RAM of 37,888,000 bits (approximately 37.9 Mbits) to support large buffering, lookup tables, and state storage.
• I/O count — 696 I/O pins to enable wide parallel connectivity and multiple high-speed interfaces.
• Package & mounting — 1517-BBGA (FCBGA) package; supplier device package specified as 1517-FBGA (40×40), designed for surface-mount PCB assembly.
• Power — Core voltage supply specified between 820 mV and 880 mV to match system power-rail requirements.
• Industrial grade temperature — Rated for operation from −40 °C to 100 °C for reliable performance across extended temperature ranges.
• Compliance — RoHS compliant for regulatory and environmental considerations.

Typical Applications

• High-density digital processing — Implement complex logic, parallel processing engines, and large custom datapaths using the device’s 420,000 logic elements.
• On-chip buffering and control — Leverage approximately 37.9 Mbits of embedded RAM for frame buffers, FIFOs, and lookup tables.
• Multi-channel I/O systems — Use 696 I/Os to connect multiple peripherals, sensors, and external interfaces in a single FPGA package.

Unique Advantages

• High integration density: Large logic and memory resources reduce the need for external components and simplify multi-function system designs.
• Extensive I/O flexibility: Nearly 700 I/Os support broad connectivity options, enabling consolidation of interfaces onto a single device.
• Industrial temperature support: −40 °C to 100 °C operating range provides robustness for temperature-challenging environments.
• Compact FCBGA package: The 1517-BBGA / 1517-FBGA (40×40) package offers a space-efficient solution for high-pin-count FPGA integration on modern PCBs.
• Controlled core power range: Defined supply range of 820 mV–880 mV supports predictable power planning and thermal management.
• RoHS compliant: Meets environmental compliance requirements for many commercial and industrial deployments.

Why Choose 5SGXEA4K3F40I3LG?

The 5SGXEA4K3F40I3LG positions itself as a high-density Stratix V GX FPGA option for designs that demand large logic capacity, significant on-chip RAM, and expansive I/O in an industrial temperature-grade package. Its combination of 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 696 I/Os makes it suitable for system-level consolidation where integration and reliability are priorities.

Engineers and procurement teams seeking a robust FPGA platform with clear electrical and thermal specifications will find this device suitable for complex embedded applications that require predictable power characteristics and RoHS compliance.

Request a quote or submit a specification inquiry to discuss availability, pricing, and lead times for the 5SGXEA4K3F40I3LG.