5SGXEA4K3F40I3N

The 5SGXEA4K3F40I3N is a Stratix V GX series FPGA from Intel designed for high-density, high-I/O system designs. It delivers a combination of large logic capacity, significant embedded memory, and comprehensive I/O resources in a compact FCBGA package.

Targeted at engineering applications that require substantial on-chip resources and documented device electrical/switching characteristics, this industrial-grade device supports designs that demand scalable logic integration and robust operating ranges.

Key Features

• Core Logic — 420,000 logic elements and 158,500 logic array blocks provide extensive programmable logic capacity for complex designs.
• Embedded Memory — Total on-chip RAM of 37,888,000 bits (approximately 37.9 Mbits) for buffering, state storage, and data processing functions.
• I/O Density — 696 I/O pins to support broad peripheral interfacing and multi-channel connectivity.
• Package & Mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type for standard PCB assembly processes.
• Power — Core voltage supply range of 820 mV to 880 mV to match system power-rail planning and characterization.
• Temperature & Grade — Industrial grade device with an operating temperature range of –40°C to 100°C for deployment in demanding environments.
• Family electrical and switching documentation — The Stratix V device datasheet documents electrical characteristics, switching characteristics, I/O timing, and programmable I/O element (IOE) behavior for design validation.
• Regulatory — RoHS compliant.

Typical Applications

• High-density logic designs — Large logic element count enables consolidation of complex digital functions into a single FPGA.
• High-bandwidth I/O and transceiver systems — Family-level transceiver and I/O timing documentation support designs requiring programmable I/O and transceiver capabilities.
• Industrial embedded systems — Industrial-grade classification and a –40°C to 100°C operating range suit deployed embedded applications that require reliable operation across wide temperatures.
• System prototyping and integration — Significant on-chip RAM and high I/O count support system-level prototyping and integration of peripherals and interfaces.

Unique Advantages

• High integration density: Large logic and memory resources reduce dependency on external components and simplify board-level architecture.
• Broad I/O capability: 696 I/Os accommodate complex peripheral sets and multi-channel designs without immediate need for external I/O expanders.
• Industrial readiness: Industrial grade and wide operating temperature range enable use in fielded equipment and demanding environments.
• Compact board footprint: 1517-BBGA (40×40 supplier package) provides a high-pin-count solution in a space-efficient form factor for dense PCB layouts.
• Documented device characteristics: Comprehensive electrical and switching parameters in the Stratix V datasheet aid in accurate timing, power, and signal-integrity analysis.
• Environmental compliance: RoHS compliance supports regulatory and procurement requirements.

Why Choose 5SGXEA4K3F40I3N?

The 5SGXEA4K3F40I3N offers a well-documented, high-capacity FPGA option within the Stratix V GX family for engineers who need substantial on-chip logic and memory, extensive I/O, and industrial-temperature operation. Its documented electrical and switching characteristics help streamline verification and system integration.

Designed for teams building complex digital systems, high-I/O platforms, and industrial embedded solutions, this device provides a balance of integration density and robust operating specifications suitable for demanding design requirements.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the 5SGXEA4K3F40I3N.