5SGXEA4K3F40I3G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 37888000 420000 1517-BBGA, FCBGA

Quantity 481 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4K3F40I3G – Stratix® V GX FPGA, 420,000 logic elements, 696 I/Os

The 5SGXEA4K3F40I3G is a Stratix V GX field programmable gate array (FPGA) from Intel, supplied in a 1517-ball FCBGA package. It delivers a high-density programmable logic fabric combined with substantial on-chip memory and a large I/O complement for demanding embedded and industrial designs.

Designed for systems that require extensive logic resources, significant embedded RAM, and broad connectivity, this industrial-grade device supports applications where integration, scalability, and rugged operating range are key considerations.

Key Features

  • Logic Resources  Approximately 420,000 logic elements providing a large programmable fabric for complex digital designs.
  • Logic Array Blocks  158,500 logic array blocks reported for fine-grain resource planning and partitioning.
  • Embedded Memory  Approximately 36 Mbits of embedded memory (37,888,000 total RAM bits) for on-chip buffering, FIFOs, and data storage.
  • I/O Capacity  696 user I/Os to support wide parallel interfaces, high-pin-count connectivity, and multi-channel designs.
  • Power/Core Voltage  Specified core supply range of 820 mV to 880 mV for system power budgeting and regulator selection.
  • Package & Mounting  1517-ball FCBGA (1517-FBGA, 40×40) surface-mount package for high-density board integration.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to meet industrial environment requirements.
  • RoHS Compliant  Manufactured in accordance with RoHS requirements.

Typical Applications

  • High-density digital processing  Use the large logic fabric and abundant embedded memory for complex DSP, packet processing, or custom compute pipelines.
  • Multi-channel I/O systems  Leverage 696 I/Os for wide parallel interfaces, multi-lane data acquisition, or extensive peripheral connectivity.
  • Industrial control and automation  Industrial temperature rating and robust packaging make this device suitable for automation controllers and real-time control platforms.
  • Prototyping and system integration  High logic and memory capacity enable integration of multiple functions on a single FPGA for rapid prototyping or production consolidation.

Unique Advantages

  • High integration density: Large logic element count and abundant embedded RAM reduce the need for external components and simplify board-level design.
  • Extensive I/O availability: 696 user I/Os allow flexible connectivity options and support for complex multi-channel systems without additional I/O expanders.
  • Industrial operating range: –40 °C to 100 °C rating supports deployment in demanding ambient conditions common in industrial environments.
  • Compact, serviceable package: 1517-ball FCBGA (40×40) offers a compact footprint for high-density board layouts while supporting surface-mount assembly.
  • Predictable power planning: Defined core voltage range (820–880 mV) aids in regulator selection and power-supply design for reliable operation.
  • Regulatory compliance: RoHS compliance aligns the device with common environmental requirements for modern electronics manufacturing.

Why Choose 5SGXEA4K3F40I3G?

The 5SGXEA4K3F40I3G positions itself as a high-capacity Stratix V GX FPGA suited for engineers building systems that require large programmable logic, substantial on-chip memory, and broad I/O connectivity within an industrial temperature envelope. Its combination of logic density, embedded RAM, and package options enables consolidation of functions and streamlined board designs.

For development teams and OEMs focused on scalable, high-resource FPGA implementations—particularly in industrial and high-density digital applications—this device offers the measurable specifications needed for system-level planning and reliable deployment.

Request a quote or submit a pricing inquiry to evaluate 5SGXEA4K3F40I3G for your next design project.

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