5SGXEA5K1F35C2N

The 5SGXEA5K1F35C2N is a Stratix® V GX field programmable gate array (FPGA) IC designed for high-density, programmable digital designs. It combines a large core logic capacity with substantial on-chip memory and a broad I/O count to address demanding logic and memory-intensive applications.

This commercial-grade GX device delivers approximately 46 Mbits of embedded memory, 490,000 logic elements, and 432 user I/Os in a compact 1152-ball FCBGA package, providing a balanced platform for complex system integration where logic density and on-chip RAM are primary requirements.

Key Features

• Core Logic Capacity — 490,000 logic elements to implement large-scale combinational and sequential logic designs.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Density — 432 user I/Os to support extensive external interfaces and parallel connectivity.
• Power Supply — Core supply range specified at 870 mV to 930 mV for precise core voltage control.
• Package & Mounting — 1152-BBGA (FCBGA) package, supplied in a 1152-FBGA (35×35) footprint suitable for surface-mount PCB assembly.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial environments.
• Standards Compliance — RoHS compliant, meeting common environmental requirements for lead-free manufacturing.

Typical Applications

• High-density digital processing — Use the extensive logic element count and on-chip RAM for computationally intensive algorithms and custom datapaths.
• Hardware acceleration & prototyping — Large logic and memory resources enable FPGA-based acceleration, emulation, and rapid hardware prototyping.
• Complex I/O interfacing — 432 user I/Os provide flexibility for parallel buses, multi-channel interfaces, and mixed-signal front-end connectivity.

Unique Advantages

• Significant logic density: 490,000 logic elements allow consolidation of large functions into a single device, reducing system complexity.
• Substantial on-chip RAM: Approximately 46 Mbits of embedded memory minimizes external memory dependencies and lowers system BOM.
• High I/O count: 432 I/Os simplify board-level routing for multi-channel and multi-interface designs, enabling denser system designs.
• Compact FCBGA footprint: 1152-ball FCBGA (35×35) package delivers a high-pin-count solution in a space-efficient form factor for surface-mount assembly.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with standard commercial deployments and applications.
• RoHS compliant: Supports lead-free manufacturing requirements for regulated markets.

Why Choose 5SGXEA5K1F35C2N?

The 5SGXEA5K1F35C2N positions itself as a high-capacity, commercial-grade Stratix V GX FPGA for designs that require a large amount of programmable logic, significant embedded memory, and broad I/O capability within a compact FCBGA package. Its specified core voltage window and commercial operating temperature make it suitable for mainstream commercial electronics and complex digital systems.

Engineers targeting system consolidation, rapid prototyping, or high-density digital implementations will find the device well-suited to reduce board-level complexity and dependencies on external memory, while providing a flexible programmable fabric for iterative development.

Request a quote or submit a procurement inquiry to evaluate 5SGXEA5K1F35C2N for your next high-density FPGA design.