5SGXEA5K1F35I2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 506 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5K1F35I2N – Stratix® V GX FPGA, 490,000 logic elements, approximately 46.08 Mbits RAM, 432 I/Os, 1152-BBGA
The 5SGXEA5K1F35I2N is a Stratix® V GX field-programmable gate array (FPGA) in a 1152-ball FCBGA package, optimized for high-density programmable logic designs. With a large logic capacity, substantial on-chip embedded memory, and a high I/O count, it is designed for demanding industrial applications that require significant integration of digital logic and interfaces.
Engineered as an industrial-grade Stratix V GX device, this FPGA offers a defined core voltage range and wide operating temperature window for reliable deployment in temperature-challenged environments.
Key Features
- Core Logic Capacity Approximately 490,000 logic elements, enabling complex FPGA implementations and large-scale programmable logic integration.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM for large buffering, lookup tables, and memory-intensive algorithms.
- I/O Resources 432 user I/Os to support extensive interfacing requirements and multi-channel system designs.
- Package 1152-ball BGA (1152-FBGA, 35 × 35) surface-mount package for dense board-level integration.
- Industrial Grade Rated industrial grade with an operating temperature range from −40°C to 100°C for deployment in industrial environments.
- Core Supply Voltage Core supply range specified from 870 mV to 930 mV to match system power rails and power delivery design.
- Standards Compliance RoHS compliant, meeting common environmental requirements for electronic components.
Typical Applications
- High-density digital processing Implement complex logic blocks and large custom processing pipelines using the device's ~490k logic elements and abundant on-chip RAM.
- I/O‑intensive system interfaces Support multiple parallel interfaces and extensive external connectivity with 432 user I/Os.
- Industrial control and automation Deploy in temperature-challenged industrial systems with the device’s industrial temperature rating of −40°C to 100°C.
- Embedded memory-heavy designs Leverage approximately 46.08 Mbits of embedded RAM for buffering, frame memory, and data staging in real-time applications.
Unique Advantages
- High logic and memory density: Combine nearly half a million logic elements with >46 Mbits of embedded RAM to consolidate functions that would otherwise require multiple devices.
- Extensive I/O capability: 432 I/Os provide headroom for multi-channel interfaces, peripheral expansion, and complex board-level connectivity.
- Industrial temperature performance: Rated from −40°C to 100°C to maintain operation across a wide range of environmental conditions common in industrial deployments.
- Compact FCBGA package: The 1152-ball (35 × 35) FCBGA package balances high pin count and a compact footprint for space-constrained, high-density PCBs.
- Defined low-voltage core: 870–930 mV core supply specification supports modern low-voltage power architectures and careful power budgeting.
- RoHS compliant: Meets RoHS environmental requirements to simplify compliance for manufactured products.
Why Choose 5SGXEA5K1F35I2N?
The 5SGXEA5K1F35I2N delivers a combination of high programmable logic capacity, substantial embedded memory, and a large I/O count in a compact FCBGA package. Its industrial rating and specified core voltage make it suitable for robust system designs that require sustained operation across a wide temperature range and precise power delivery.
This Stratix V GX device is appropriate for engineering teams building high-density, memory‑heavy, and I/O-rich designs that benefit from integration and scalability. Its specification set supports long-term deployment needs where consistent electrical and thermal characteristics are required.
Request a quote or submit an inquiry to obtain availability and pricing information for the 5SGXEA5K1F35I2N and to discuss how this Stratix V GX FPGA can meet your project requirements.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018