5SGXEA5K1F35I2N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA

Quantity 506 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5K1F35I2N – Stratix® V GX FPGA, 490,000 logic elements, approximately 46.08 Mbits RAM, 432 I/Os, 1152-BBGA

The 5SGXEA5K1F35I2N is a Stratix® V GX field-programmable gate array (FPGA) in a 1152-ball FCBGA package, optimized for high-density programmable logic designs. With a large logic capacity, substantial on-chip embedded memory, and a high I/O count, it is designed for demanding industrial applications that require significant integration of digital logic and interfaces.

Engineered as an industrial-grade Stratix V GX device, this FPGA offers a defined core voltage range and wide operating temperature window for reliable deployment in temperature-challenged environments.

Key Features

  • Core Logic Capacity  Approximately 490,000 logic elements, enabling complex FPGA implementations and large-scale programmable logic integration.
  • Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for large buffering, lookup tables, and memory-intensive algorithms.
  • I/O Resources  432 user I/Os to support extensive interfacing requirements and multi-channel system designs.
  • Package  1152-ball BGA (1152-FBGA, 35 × 35) surface-mount package for dense board-level integration.
  • Industrial Grade  Rated industrial grade with an operating temperature range from −40°C to 100°C for deployment in industrial environments.
  • Core Supply Voltage  Core supply range specified from 870 mV to 930 mV to match system power rails and power delivery design.
  • Standards Compliance  RoHS compliant, meeting common environmental requirements for electronic components.

Typical Applications

  • High-density digital processing  Implement complex logic blocks and large custom processing pipelines using the device's ~490k logic elements and abundant on-chip RAM.
  • I/O‑intensive system interfaces  Support multiple parallel interfaces and extensive external connectivity with 432 user I/Os.
  • Industrial control and automation  Deploy in temperature-challenged industrial systems with the device’s industrial temperature rating of −40°C to 100°C.
  • Embedded memory-heavy designs  Leverage approximately 46.08 Mbits of embedded RAM for buffering, frame memory, and data staging in real-time applications.

Unique Advantages

  • High logic and memory density: Combine nearly half a million logic elements with >46 Mbits of embedded RAM to consolidate functions that would otherwise require multiple devices.
  • Extensive I/O capability: 432 I/Os provide headroom for multi-channel interfaces, peripheral expansion, and complex board-level connectivity.
  • Industrial temperature performance: Rated from −40°C to 100°C to maintain operation across a wide range of environmental conditions common in industrial deployments.
  • Compact FCBGA package: The 1152-ball (35 × 35) FCBGA package balances high pin count and a compact footprint for space-constrained, high-density PCBs.
  • Defined low-voltage core: 870–930 mV core supply specification supports modern low-voltage power architectures and careful power budgeting.
  • RoHS compliant: Meets RoHS environmental requirements to simplify compliance for manufactured products.

Why Choose 5SGXEA5K1F35I2N?

The 5SGXEA5K1F35I2N delivers a combination of high programmable logic capacity, substantial embedded memory, and a large I/O count in a compact FCBGA package. Its industrial rating and specified core voltage make it suitable for robust system designs that require sustained operation across a wide temperature range and precise power delivery.

This Stratix V GX device is appropriate for engineering teams building high-density, memory‑heavy, and I/O-rich designs that benefit from integration and scalability. Its specification set supports long-term deployment needs where consistent electrical and thermal characteristics are required.

Request a quote or submit an inquiry to obtain availability and pricing information for the 5SGXEA5K1F35I2N and to discuss how this Stratix V GX FPGA can meet your project requirements.

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