5SGXEA5K1F40C2G

The 5SGXEA5K1F40C2G is a Stratix V GX Field Programmable Gate Array (FPGA) IC delivered in a 1517-BBGA FCBGA package. It provides a high-density programmable logic fabric with a substantial on-chip memory footprint and extensive I/O capability.

Key characteristics such as 490,000 logic elements, approximately 46 Mbits of embedded memory, and up to 696 I/O pins make this device suitable for designs that require dense logic integration, large embedded RAM, and plentiful external connectivity within a commercial temperature range.

Key Features

• Core density  490,000 logic elements for complex, high-density programmable logic implementations.
• Embedded memory  Approximately 46 Mbits of on-chip RAM to support large data buffers, LUT storage, and memory-intensive algorithms.
• I/O capacity  Up to 696 I/O pins to accommodate broad interfacing requirements and multi-channel connectivity.
• Power  Core voltage supply range specified at 870 mV to 930 mV for the FPGA core.
• Package & mounting  1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount FCBGA form factor for board-level integration.
• Temperature & grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS compliant.
• Documentation  Device electrical and switching characteristics are covered by the Stratix V device datasheet.

Typical Applications

• High-density programmable logic designs  Utilize the large logic element count for complex combinational and sequential logic implementations.
• Memory-intensive processing  Leverage approximately 46 Mbits of embedded memory for buffering, lookup tables, and algorithm state storage.
• I/O‑heavy systems  Take advantage of up to 696 I/O pins for multi-channel interfaces and broad peripheral connectivity.
• Board-level integration  Surface-mount 1517-FBGA package supports compact, high-density PCB layouts.

Unique Advantages

• High logic integration: 490,000 logic elements enable consolidation of large logic functions on a single device, reducing board-level component count.
• Substantial on-chip RAM: Approximately 46 Mbits of embedded memory reduces reliance on external memory for many use cases.
• Extensive I/O: Up to 696 I/O pins provide flexibility for complex interfacing and multi-channel I/O requirements.
• Compact FCBGA package: 1517-FBGA (40×40) surface-mount package supports dense PCB designs while maintaining thermal and electrical connectivity expected of BGA packages.
• Low-voltage core operation: Core supply specified between 870 mV and 930 mV supports the device’s power requirements as documented.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet standard commercial-environment deployments.

Why Choose 5SGXEA5K1F40C2G?

The 5SGXEA5K1F40C2G offers a combination of high logic element count, substantial embedded memory, and a large I/O complement in a surface-mount FCBGA package—providing a platform for dense, memory-aware designs that require broad external connectivity. Its commercial-grade specification and documented electrical characteristics in the Stratix V device datasheet make it suitable for engineers and procurement teams targeting high-density programmable logic implementations.

This device is appropriate for projects where consolidating complex logic, reducing external memory dependency, and supporting extensive I/O on a single FPGA are priorities, backed by the Stratix V family documentation.

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