5SGXEA5K1F35I2G

The 5SGXEA5K1F35I2G is an Intel Stratix V GX FPGA configured for high-density programmable logic integration. It provides substantial on-chip resources—including approximately 490,000 logic elements, roughly 46 Mbits of embedded RAM, and 432 I/O pins—packaged in a 1152-BBGA (35 × 35) surface-mount footprint.

Specified as an industrial-grade device with an operating temperature range of −40 °C to 100 °C and a core supply window of 870 mV to 930 mV, this device is targeted at designs that require large programmable logic capacity, significant embedded memory, and high I/O density in a compact, RoHS-compliant package.

Key Features

• Core Capacity — Approximately 490,000 logic elements for large-scale programmable logic implementations.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM (46,080,000 total RAM bits) to support data buffering and internal storage needs.
• I/O Density — 432 available I/O pins to accommodate multiple interfaces and peripheral connections.
• Power Supply — Core voltage range of 870 mV to 930 mV for defined power design and margining.
• Package & Mounting — 1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount configuration for compact board integration.
• Operating Range & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance — RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Large-scale programmable logic designs — Deploy when designs require up to 490,000 logic elements and substantial on-chip RAM for complex logic and state storage.
• High-pin-count I/O systems — Use in systems that need extensive I/O connectivity enabled by 432 I/O pins within a single device.
• Industrial-temperature deployments — Suitable for applications operating across −40 °C to 100 °C where an industrial-grade FPGA is required.

Unique Advantages

• Substantial logic capacity: 490,000 logic elements provide the resources required for large and complex designs.
• Significant embedded memory: Approximately 46 Mbits of on-chip RAM reduces dependence on external memory for many use cases.
• High I/O count: 432 I/O pins enable consolidation of multiple interfaces and peripherals around a single FPGA.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployments in temperature-sensitive environments.
• Compact, high-pin-count package: 1152-BBGA (35×35) surface-mount package concentrates functionality in a standard board footprint.
• RoHS compliant: Meets lead-free manufacturing requirements for regulated production environments.

Why Choose 5SGXEA5K1F35I2G?

The 5SGXEA5K1F35I2G delivers a combination of large programmable logic capacity, substantial embedded RAM, and high I/O density in a 1152-BBGA surface-mount package. Its industrial-grade temperature specification and RoHS compliance make it a practical choice for deployment in temperature-challenging and regulated manufacturing environments.

Designers and teams that require a tightly specified core voltage range (870 mV to 930 mV), high on-chip resource density, and a compact high-pin-count package will find this Stratix V GX FPGA suitable for complex, space-constrained applications.

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