5SGXEA5K1F40C2N

The 5SGXEA5K1F40C2N is a Stratix® V GX field-programmable gate array (FPGA) in a 1517-FBGA (40×40) package. It provides high logic density and large on-chip RAM for complex, high‑integration digital designs.

Key on‑device resources include 490,000 logic elements, approximately 46.08 Mbits of embedded memory, and 696 user I/Os, making the device suited to designs that require abundant logic, high I/O count, and substantial embedded RAM while operating at a low core voltage.

Key Features

• Core Architecture — Stratix V GX High-density Stratix V GX FPGA family device designed for programmable logic applications.
• Logic Capacity 490,000 logic elements and 185,000 logic array blocks for large-scale logic implementation.
• Embedded Memory Approximately 46.08 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage.
• I/O Resources 696 general-purpose I/Os to support complex board-level interfacing and high-pin-count applications.
• Power Supply Core voltage range specified at 0.870 V to 0.930 V for low-voltage core operation.
• Package & Mounting 1517-BBGA / FCBGA package (supplier device package 1517-FBGA, 40×40); surface-mount device for compact board layouts.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density digital systems — Implements large combinational and sequential logic networks using the device’s 490,000 logic elements and extensive on-chip RAM.
• High I/O interfacing — Supports designs that require many external signals or parallel interfaces with its 696 user I/Os.
• Embedded memory‑heavy designs — Uses approximately 46.08 Mbits of embedded RAM for buffering, FIFOs, and data storage within the FPGA fabric.

Unique Advantages

• High logic density: 490,000 logic elements enable implementation of complex digital functions without immediate need for external glue logic.
• Substantial on‑chip RAM: Approximately 46.08 Mbits of embedded memory reduces dependence on external memory for many use cases.
• Extensive I/O count: 696 I/Os accommodate high‑pin‑count interfaces and parallel connectivity requirements.
• Compact FCBGA package: 1517-FBGA (40×40) package supports dense board designs while providing the device’s full resource set.
• Low-voltage core operation: 0.870–0.930 V supply range enables core power optimization in system-level power budgets.
• Commercial temperature grade: Rated for 0 °C to 85 °C, suitable for standard commercial environments.

Why Choose 5SGXEA5K1F40C2N?

The 5SGXEA5K1F40C2N combines large logic capacity, substantial embedded memory, and a high I/O count in a compact 1517-FBGA package, providing a balanced platform for complex, high‑integration FPGA designs. Its commercial temperature rating and RoHS compliance make it appropriate for mainstream electronic products developed for standard operating environments.

This part is well suited for design teams that require scalable logic resources, significant on‑chip RAM, and extensive interfacing options in a single device while operating at a low core voltage. Its resource mix supports consolidation of functionality onto a single FPGA to simplify board architecture and reduce BOM complexity.

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