5SGXEA5N2F40C3N

The 5SGXEA5N2F40C3N is a Stratix® V GX FPGA from Intel designed for high-density, high-I/O digital designs. It combines 490,000 logic elements with approximately 46 Mbits of embedded memory and a 600-pin I/O capability in a 1517-FBGA (40×40) surface-mount package.

Targeted at commercial-temperature applications, this device provides a large, low-voltage core fabric (0.820–0.880 V supply) and extensive on-chip resources for designs that require substantial logic capacity, memory, and I/O integration.

Key Features

• Logic Capacity 490,000 logic elements for complex digital implementation and system integration.
• Embedded Memory Approximately 46 Mbits of on-chip RAM to support large buffers, lookup tables, and data-path storage.
• I/O Density 600 user I/Os to interface with high-pin-count peripherals and multiple high-speed interfaces.
• Package and Mounting 1517-BBGA, FCBGA (1517-FBGA 40×40) package; surface-mount for compact board integration.
• Power and Core Voltage Core supply specified from 820 mV to 880 mV for device operation within defined electrical limits.
• Operating Temperature Commercial grade operation from 0 °C to 85 °C.
• RoHS Compliant Meets RoHS environmental requirements.
• Series-Level Transceiver Documentation The Stratix V series datasheet documents GX transceiver speed grades and related electrical characteristics for Stratix V GX devices (series-level information included in the datasheet).

Typical Applications

• High-density digital systems Where large logic capacity and extensive I/O are required to consolidate multiple functions into a single FPGA.
• Data buffering and data-path processing Leveraging approximately 46 Mbits of embedded memory for intermediate storage and streaming data tasks.
• Complex interface aggregation Using 600 I/Os to connect multiple peripherals, boards, or high-pin-count subsystems in commercial designs.

Unique Advantages

• Highly integrated fabric: 490,000 logic elements enable consolidation of complex logic, reducing external component count.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM lowers reliance on external memory for many buffering and storage requirements.
• Exceptional I/O capacity: 600 I/Os support dense interface requirements and multi-channel connectivity without board-level multiplexing compromises.
• Compact, manufacturable package: 1517-FBGA (40×40) surface-mount package supports high-density PCB layouts and automated assembly processes.
• Commercial-temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments.
• Environmentally compliant: RoHS compliance aligns with common environmental and supply-chain requirements.

Why Choose 5SGXEA5N2F40C3N?

The 5SGXEA5N2F40C3N positions itself as a high-capacity Stratix V GX device for commercial applications that demand extensive logic, embedded memory, and a large number of I/Os in a single FPGA package. Its low-voltage core and series-documented transceiver characteristics (as presented in the Stratix V GX series datasheet) make it suitable for designers consolidating complex digital functions while managing board space and component count.

Choose this device when your design requires a balance of large logic resources, substantial on-chip RAM, and high I/O density delivered in a 1517-FBGA footprint with commercial-temperature operation and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXEA5N2F40C3N Stratix® V GX FPGA for your next design.