5SGXEA5N2F40I2LN

The 5SGXEA5N2F40I2LN is a Stratix® V GX field-programmable gate array (FPGA) manufactured by Intel. It delivers high on-chip logic capacity and embedded memory with a large I/O count in a 1517-BBGA FCBGA package for surface-mount applications.

Designed for industrial-grade environments, the device combines approximately 490,000 logic elements, roughly 46.08 Mbits of embedded memory, and up to 600 I/O pins, making it suitable for designs that require high integration density, extensive interfacing, and operation across a wide temperature range.

Key Features

• Core capacity — 490,000 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded memory — Approximately 46.08 Mbits of on-chip RAM to support buffering, lookup tables, and large state machines.
• I/O density — Up to 600 general-purpose I/O pins to accommodate wide external interfacing and multiple parallel buses.
• Transceiver family characteristics — As part of the Stratix V GX family, device series documentation includes transceiver speed-grade options; series-level GX channel capability reaches up to 14.1 Gbps depending on speed grade.
• Power — Core voltage supply range of 0.820 V to 0.880 V for the device core.
• Package and mounting — 1517-BBGA (FCBGA) supplier package 1517-FBGA (40×40) in a surface-mount form factor.
• Industrial temperature rating — Rated for operation from −40°C to 100°C.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital systems — Use the large logic element count and embedded memory for complex control logic, data-path processing, and algorithm acceleration.
• High-speed I/O and transceiver interfaces — Leverage the Stratix V GX family transceiver capabilities (series-level support up to 14.1 Gbps depending on speed grade) and 600 I/Os for multi-lane serial and parallel interfaces.
• Industrial control and instrumentation — Industrial-grade temperature range (−40°C to 100°C) and RoHS compliance make the device suited for robust, field-deployed systems.
• Board-level integration — High logic density and abundant I/O reduce the need for external glue logic, simplifying board designs with surface-mount 1517-BBGA packaging.

Unique Advantages

• High on-chip integration: 490,000 logic elements and ~46.08 Mbits of embedded memory consolidate complex functions on a single FPGA, reducing external components.
• Extensive interfacing options: Up to 600 I/O pins enable flexible connectivity for a broad range of peripherals and high-bandwidth buses.
• Industrial-grade operation: Specified for −40°C to 100°C operation to meet demanding environmental requirements.
• Low-voltage core operation: Core supply between 0.820 V and 0.880 V supports integration with modern low-voltage power architectures.
• Surface-mount BBGA packaging: 1517-BBGA (1517-FBGA, 40×40) supports compact board layouts and automated assembly processes.
• Backed by Stratix V documentation: Device electrical and switching characteristics, including transceiver guidance and operating conditions, are provided in the Stratix V device datasheet.

Why Choose 5SGXEA5N2F40I2LN?

The 5SGXEA5N2F40I2LN offers a combination of high logic density, substantial on-chip memory, and extensive I/O in an industrial-grade Stratix V GX FPGA package from Intel. Its operating voltage range, packaging, and temperature rating make it a practical choice for designs that require significant programmable resources and reliable operation in challenging environments.

This device is appropriate for engineering teams seeking a high-capacity FPGA platform backed by Stratix V series documentation and Intel manufacturing. It supports scalable designs where consolidation of logic, memory, and I/O can reduce board complexity and component count.

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