5SGXEA5N2F40I3L

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 46080000 490000 1517-BBGA, FCBGA

Quantity 1,505 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5N2F40I3L – Stratix® V GX FPGA, 490,000 logic elements, 600 I/Os

The 5SGXEA5N2F40I3L is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for industrial-grade, high-density programmable logic applications. It integrates approximately 490,000 logic elements and approximately 46 Mbits of embedded memory to support complex system-level functions and data buffering on a single device.

With 600 user I/Os, a low-voltage core supply range (820 mV to 880 mV), and a compact 1517-BBGA FCBGA surface-mount package, this device targets industrial systems that require high I/O connectivity, substantial on-chip memory and logic capacity, and extended operating temperature capability.

Key Features

  • Core Logic Capacity — Approximately 490,000 logic elements provide the device-level programmability required for large digital designs and complex state machines.
  • Logic Array Blocks — 185,000 logic array blocks (LABs/CLBs) for structured, high-density implementation of logic and routing resources.
  • Embedded Memory — Approximately 46 Mbits of on-chip RAM to support buffering, lookup tables, and embedded data storage without external memory.
  • I/O Count — 600 user I/Os to support extensive peripheral interfacing, multi-channel sensor aggregation, and parallel data paths.
  • Power and Voltage — Core voltage supply specified between 820 mV and 880 mV to match low-voltage system designs and enable predictable power budgeting.
  • Package and Mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA package, surface-mount mounting type for compact board-level integration.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.
  • Datasheet-backed Specifications — Electrical and switching characteristics and device-specific operating requirements are documented in the Stratix V device datasheet.

Typical Applications

  • Industrial Control Systems — High logic density and 600 I/Os enable complex control algorithms, multi-axis motor control, and extensive sensor interfacing within industrial equipment.
  • High-density Networking & Communications — Large on-chip RAM and abundant I/Os support packet buffering, parallel interfaces, and custom protocol handling in networking appliances.
  • Data Acquisition & Processing — Significant logic and embedded memory capacity are suitable for real-time signal processing, aggregation of multi-channel inputs, and preprocessing before host transfer.
  • Test, Measurement & Instrumentation — Robust temperature range and high I/O count allow reliable operation in test systems requiring data aggregation, timing generation, and protocol conversion.

Unique Advantages

  • High integration density: Approximately 490,000 logic elements and 46 Mbits of embedded RAM reduce the need for external logic and memory, simplifying system BOM and board complexity.
  • Extensive I/O availability: 600 user I/Os enable broad connectivity for sensors, interfaces and parallel data channels without additional I/O expanders.
  • Industrial-ready thermal range: −40 °C to 100 °C operation supports deployment in demanding industrial environments.
  • Compact FCBGA packaging: 1517-BBGA package provides a dense footprint for space-constrained, surface-mount PCB designs.
  • Predictable low-voltage core: 820 mV–880 mV core supply allows consistent power planning for system designers targeting low-voltage architectures.
  • Regulatory compliance: RoHS compliance supports lead-free assembly processes and environmental requirements.

Why Choose 5SGXEA5N2F40I3L?

The 5SGXEA5N2F40I3L positions itself as a high-density, industrial-grade Stratix V GX FPGA suitable for engineering teams that need substantial on-chip logic, memory and I/O in a single, surface-mount package. Its combination of nearly half a million logic elements, approximately 46 Mbits of embedded RAM, and 600 I/Os provides a solid platform for demanding control, communication and data-processing designs that must operate across an extended temperature range.

Designed for scalability and robust operation, this FPGA is appropriate for system integrators and OEMs implementing complex, long-life industrial solutions where integration density, I/O capacity and predictable electrical characteristics are key considerations. Detailed electrical and switching parameters are specified in the Stratix V device documentation to support engineering validation and system integration.

Request a quote or submit an inquiry to receive pricing and lead-time information for 5SGXEA5N2F40I3L and to discuss availability for your design needs.

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