5SGXEA5N2F40I2L

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 46080000 490000 1517-BBGA, FCBGA

Quantity 1,800 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5N2F40I2L – Stratix® V GX FPGA IC, Industrial Grade, 1517-FBGA (40×40)

The 5SGXEA5N2F40I2L is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It delivers large on-chip logic and embedded memory capacity with extensive I/O, packaged in a 1517-ball FCBGA for surface-mount applications.

Engineered for high-density logic and memory-centric designs, this device is suitable for applications that require substantial programmable logic resources, significant embedded RAM, and a high pin-count interface within an industrial operating range.

Key Features

  • Core Logic Capacity  Approximately 490,000 logic elements (cells) to implement complex FPGA designs and large-scale custom logic functions.
  • Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support large buffers, lookup tables, and local data storage without external memory.
  • I/O Density  600 user I/O pins providing broad connectivity for high-channel-count interfaces and board-level integration.
  • Package & Mounting  1517-BBGA (FCBGA) supplier device package; supplier package listed as 1517-FBGA (40×40). Surface-mount mounting type for compact PCB integration.
  • Power Supply  Core voltage supply range of 820 mV to 880 mV for the device core power rails.
  • Industrial Temperature  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High-performance signal processing  Large logic capacity and substantial embedded RAM enable implementation of complex DSP pipelines and on-chip buffering for real-time processing.
  • Network and telecom systems  High I/O count supports multi-channel interfaces and board-level connectivity required in networking and communications equipment.
  • Hardware acceleration  Large logic resources and memory make the device suitable for offloading compute-intensive tasks and custom accelerators in industrial systems.
  • Industrial control and instrumentation  Industrial temperature rating and extensive I/O allow deployment in robust control systems and instrumentation applications.

Unique Advantages

  • High integration of logic and memory  Approximately 490k logic elements paired with ~46.08 Mbits of embedded RAM reduces reliance on external components and simplifies board design.
  • Extensive I/O for complex systems  600 I/O pins provide flexibility to interface with multiple peripherals, sensors, and high-density connectors.
  • Industrial thermal range  Specified operation from −40 °C to 100 °C supports deployment in demanding ambient conditions.
  • Compact BGA package  1517-ball FCBGA packaging (40×40) offers a high-pin-count solution in a manageable PCB footprint for dense designs.
  • RoHS compliance  Environmentally compliant material status for regulated manufacturing environments.

Why Choose 5SGXEA5N2F40I2L?

The 5SGXEA5N2F40I2L positions itself as a high-density, memory-rich Stratix V GX FPGA option for engineers designing industrial-grade systems that require substantial programmable logic, on-chip RAM, and a large I/O complement. Its industrial temperature rating and compact FCBGA package make it appropriate for robust board-level integration where reliability and integration density matter.

Choose this device when your design demands extensive on-chip resources and a high pin count while maintaining industrial temperature capability and RoHS compliance. The device is well-suited to teams focused on scalable FPGA-based processing, connectivity, and hardware acceleration within industrial product lines.

Request a quote or submit a parts inquiry for 5SGXEA5N2F40I2L to receive pricing and availability information.

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