5SGXEA5N2F40I2L
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 46080000 490000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,800 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5N2F40I2L – Stratix® V GX FPGA IC, Industrial Grade, 1517-FBGA (40×40)
The 5SGXEA5N2F40I2L is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It delivers large on-chip logic and embedded memory capacity with extensive I/O, packaged in a 1517-ball FCBGA for surface-mount applications.
Engineered for high-density logic and memory-centric designs, this device is suitable for applications that require substantial programmable logic resources, significant embedded RAM, and a high pin-count interface within an industrial operating range.
Key Features
- Core Logic Capacity Approximately 490,000 logic elements (cells) to implement complex FPGA designs and large-scale custom logic functions.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM to support large buffers, lookup tables, and local data storage without external memory.
- I/O Density 600 user I/O pins providing broad connectivity for high-channel-count interfaces and board-level integration.
- Package & Mounting 1517-BBGA (FCBGA) supplier device package; supplier package listed as 1517-FBGA (40×40). Surface-mount mounting type for compact PCB integration.
- Power Supply Core voltage supply range of 820 mV to 880 mV for the device core power rails.
- Industrial Temperature Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
- Environmental Compliance RoHS compliant.
Typical Applications
- High-performance signal processing Large logic capacity and substantial embedded RAM enable implementation of complex DSP pipelines and on-chip buffering for real-time processing.
- Network and telecom systems High I/O count supports multi-channel interfaces and board-level connectivity required in networking and communications equipment.
- Hardware acceleration Large logic resources and memory make the device suitable for offloading compute-intensive tasks and custom accelerators in industrial systems.
- Industrial control and instrumentation Industrial temperature rating and extensive I/O allow deployment in robust control systems and instrumentation applications.
Unique Advantages
- High integration of logic and memory Approximately 490k logic elements paired with ~46.08 Mbits of embedded RAM reduces reliance on external components and simplifies board design.
- Extensive I/O for complex systems 600 I/O pins provide flexibility to interface with multiple peripherals, sensors, and high-density connectors.
- Industrial thermal range Specified operation from −40 °C to 100 °C supports deployment in demanding ambient conditions.
- Compact BGA package 1517-ball FCBGA packaging (40×40) offers a high-pin-count solution in a manageable PCB footprint for dense designs.
- RoHS compliance Environmentally compliant material status for regulated manufacturing environments.
Why Choose 5SGXEA5N2F40I2L?
The 5SGXEA5N2F40I2L positions itself as a high-density, memory-rich Stratix V GX FPGA option for engineers designing industrial-grade systems that require substantial programmable logic, on-chip RAM, and a large I/O complement. Its industrial temperature rating and compact FCBGA package make it appropriate for robust board-level integration where reliability and integration density matter.
Choose this device when your design demands extensive on-chip resources and a high pin count while maintaining industrial temperature capability and RoHS compliance. The device is well-suited to teams focused on scalable FPGA-based processing, connectivity, and hardware acceleration within industrial product lines.
Request a quote or submit a parts inquiry for 5SGXEA5N2F40I2L to receive pricing and availability information.

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