5SGXEA7K1F35C2LG

The 5SGXEA7K1F35C2LG is a Stratix® V GX field programmable gate array (FPGA) in a 1152-BBGA FCBGA package, offering high logic density and substantial on-chip memory for complex custom digital designs. With 622,000 logic elements and approximately 51.2 Mbits of embedded RAM, this commercial-grade device is suited to designs that require large programmable logic resources, significant buffering or scratchpad memory, and a high count of general-purpose I/Os.

Key Features

• Core Logic  Approximately 622,000 logic elements provide a large fabric for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM enables significant local buffering, FIFOs, and memory-mapped data structures without external memory for many use cases.
• I/O Capacity  432 I/O pins support wide parallel interfaces, multiple protocol endpoints, and flexible board-level connectivity.
• Supply Voltage  Core voltage supply range 820 mV to 880 mV, allowing designers to plan power delivery and decoupling for the FPGA core.
• Package & Mounting  1152-BBGA (FCBGA) surface-mount package (supplier package: 1152-FBGA, 35 × 35 mm) for high-density PCB implementations.
• Operating Conditions & Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Custom Compute Acceleration  Implement application-specific data paths and hardware accelerators using the device's large logic capacity and on-chip memory.
• High‑Bandwidth Data Buffering  Use the embedded RAM for local buffering and packet processing where significant on-chip memory reduces external memory dependency.
• I/O-Intensive Interface Bridging  Leverage 432 I/Os to bridge multiple parallel interfaces, host connectors, or board-level peripherals in complex systems.
• Prototype and System Integration  Rapidly iterate system-level designs that require dense programmable logic and flexible I/O mapping during development.

Unique Advantages

• High Logic Density: ~622,000 logic elements let you consolidate complex functionality into a single FPGA, reducing BOM and inter-chip latency.
• Substantial On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM supports large buffers and local storage for performance-sensitive designs.
• Large I/O Count: 432 user I/Os simplify integration with multiple interfaces and parallel data paths without additional I/O expanders.
• Compact, High‑Density Package: 1152-BBGA FCBGA packaging enables a compact PCB footprint while preserving connectivity and thermal considerations.
• Commercial Grade & RoHS Compliant: Designed for commercial-temperature operation (0 °C to 85 °C) and RoHS compliance to meet common manufacturing requirements.

Why Choose 5SGXEA7K1F35C2LG?

The 5SGXEA7K1F35C2LG positions itself as a high-density Stratix V GX FPGA option for projects that demand extensive programmable logic, sizable embedded memory, and a high number of I/Os in a compact BGA package. Its specifications make it well suited for designers consolidating complex logic, implementing sizable on-chip data structures, or integrating multiple interfaces onto a single device.

For teams targeting commercial-temperature deployments and RoHS-compliant manufacturing, this FPGA provides a balance of logic capacity, memory resource, and I/O flexibility while supporting standard surface-mount board assembly practices.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXEA7K1F35C2LG FPGA.