5SGXEA7K1F35I2N

The 5SGXEA7K1F35I2N is a Stratix V GX family FPGA offered in an industrial temperature grade and a 1152‑ball BGA surface‑mount package. It combines high logic density, substantial on‑chip memory, and a wide set of I/O resources to address complex digital designs that require significant programmable logic and memory integration.

Designed for applications that demand large programmable fabric and robust operating conditions, this device provides 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 432 general‑purpose I/O pins while operating from a core voltage range of 870 mV to 930 mV and an ambient temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity — 622,000 logic elements for implementing large-scale custom logic, datapaths, and control systems.
• On‑chip Memory — Approximately 51.2 Mbits of embedded RAM to support buffers, FIFOs, and on‑chip data storage for high‑throughput designs.
• I/O Resources — 432 I/O pins to connect high‑pin‑count interfaces and multiple peripherals directly to the FPGA fabric.
• Package & Mounting — Surface‑mount 1152‑BBGA (FCBGA) supplier device package: 1152‑FBGA (35×35), enabling compact board integration.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet a wide range of environmental requirements.
• Core Voltage — Core supply range of 870 mV to 930 mV for compatibility with Stratix V power domains.
• RoHS Compliant — Meets RoHS requirements for lead‑free assembly and regulatory compliance.
• Stratix V GX Series Characteristics — Built on the Stratix V GX device family; series documentation describes a range of transceiver and core speed grades available for Stratix V GX devices.

Typical Applications

• High‑performance networking — Large logic fabric and abundant memory enable implementation of packet processing, switching, and protocol offload engines with extensive I/O connectivity.
• Telecommunications equipment — Industrial temperature rating and high I/O count support line cards, interface bridging, and FPGA‑based protocol handling in telecom systems.
• Signal processing and acceleration — Substantial logic and embedded RAM capacity suit DSP pipelines, custom accelerators, and real‑time data processing functions.

Unique Advantages

• Large programmable fabric: 622,000 logic elements provide headroom for complex state machines, wide datapaths, and large custom cores, reducing the need for multiple devices.
• Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM lowers external memory dependency and improves system latency for buffering and caching.
• Extensive I/O connectivity: 432 I/O pins simplify integration of multiple high‑speed interfaces and peripheral buses without external multiplexing.
• Industrial robustness: −40 °C to 100 °C rating and surface‑mount BGA packaging support deployment in demanding environments.
• Compact board footprint: 1152‑ball FCBGA (35×35) package enables dense board layouts for space‑constrained systems.
• Standards‑aligned supply and compliance: Core voltage range of 870–930 mV and RoHS compliance help streamline power design and regulatory requirements.

Why Choose 5SGXEA7K1F35I2N?

The 5SGXEA7K1F35I2N positions itself as a high‑capacity Stratix V GX FPGA suited for designs that require a combination of large logic resources, substantial embedded memory, and broad I/O. Its industrial temperature rating and BGA package make it appropriate for systems where environmental robustness and compact integration are priorities.

Choose this device when your design demands scalable programmable logic, significant on‑chip RAM, and plentiful I/O pins—backed by the Stratix V family documentation and platform characteristics to guide system implementation and power provisioning.

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