5SGXEA7K1F40C1WN

The 5SGXEA7K1F40C1WN is an Intel Stratix V GX field-programmable gate array offered in a high-density FCBGA package. It provides a large programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of embedded memory, combined with up to 696 general-purpose I/Os for complex system integration.

Designed as a commercial-grade, surface-mount device, this Stratix V GX part targets applications that require substantial on-chip logic, large on-chip RAM capacity, and high I/O counts while operating within a core voltage range of 0.87 V to 0.93 V and an ambient temperature range of 0 °C to 85 °C.

Key Features

• High-density logic: 622,000 logic elements provide extensive programmability for large-scale digital designs and complex logic implementations.
• On-chip memory: Approximately 51.2 Mbits of embedded RAM to support buffering, lookup tables, and algorithmic state storage directly on the FPGA fabric.
• Extensive I/O capability: Up to 696 I/Os to support broad peripheral connectivity, board-level interfacing, and multi-channel system designs.
• Package and mounting: 1517-BBGA FCBGA package (supplier device package 1517-FBGA, 40×40) in a surface-mount form factor for high-pin-count board implementations.
• Power requirements: Core voltage supply specified from 870 mV to 930 mV, enabling predictable power budgeting for the FPGA core.
• Commercial grade and compliance: Commercial temperature grade (0 °C to 85 °C) and RoHS-compliant for standard commercial deployments.

Typical Applications

• High-density custom logic: Large-scale digital designs that require hundreds of thousands of logic elements and significant embedded RAM.
• I/O-intensive interfacing: Board-level bridging, protocol aggregation, and multi-channel interfaces that leverage up to 696 I/Os.
• Prototyping and development: Hardware prototyping and algorithm development that benefit from a large programmable fabric and substantial on-chip memory.

Unique Advantages

• Substantial programmable capacity: 622,000 logic elements enable complex, time-critical logic and large parallel architectures without immediate external logic expansion.
• Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage needs.
• High I/O count: 696 I/Os simplify integration with multiple peripherals, sensors, and high-channel-count systems, lowering board-level routing complexity.
• Compact, high-pin package: 1517-BBGA (1517-FBGA, 40×40) offers high pin density in a surface-mount footprint for space-constrained, high-performance boards.
• Design predictability: Defined operating conditions—0.87 V to 0.93 V core supply and 0 °C to 85 °C temperature range—allow straightforward power and thermal planning.
• Regulatory readiness: RoHS-compliant construction supports environmentally conscious product development and supply chain requirements.

Why Choose 5SGXEA7K1F40C1WN?

This Intel Stratix V GX FPGA balances very large logic capacity, considerable embedded memory, and a high I/O count in a single commercial-grade FCBGA package—making it suitable for demanding digital designs that require on-chip resources and dense board-level connectivity. The device’s clear electrical parameters and RoHS compliance help accelerate integration into commercial systems while simplifying BOM and thermal planning.

Engineers and procurement teams looking for a high-density, commercially graded FPGA with substantial on-chip RAM and broad I/O capability will find the 5SGXEA7K1F40C1WN suitable for development, prototyping, and production applications that fit within the specified voltage and temperature ranges.

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