5SGXEA7K1F40C1N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 371 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7K1F40C1N – Stratix® V GX FPGA, 622,000 logic elements, 1517-FBGA
The 5SGXEA7K1F40C1N is a Stratix® V GX field programmable gate array (FPGA) in a 1517-ball FCBGA package designed for commercial-temperature applications. It integrates a large logic fabric, substantial on-chip RAM, and a high I/O count to address complex, high-density digital designs.
This device is aimed at systems that require extensive programmable logic capacity and memory within a surface-mount FPGA package while operating over a commercial temperature range and a nominal core supply of 0.87–0.93 V.
Key Features
- Core Logic Approximately 622,000 logic elements for implementing large-scale digital logic, custom accelerators, and complex state machines.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage for high-throughput designs.
- I/O Capacity Up to 696 I/O pins to enable wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
- Power Core supply voltage specified at 0.870 V to 0.930 V, enabling predictable power budgeting and supply design.
- Package & Mounting 1517-BBGA / 1517-FBGA (40×40) FCBGA surface-mount package for compact, high-density PCB implementations.
- Operating Range Commercial-grade operation from 0 °C to 85 °C to suit a wide range of commercial and industrial-adjacent applications.
- Compliance RoHS compliant for environmental and regulatory alignment in commercial product designs.
Typical Applications
- High-density digital systems Implement large logic designs and programmable datapaths where a high logic element count and significant on-chip RAM are required.
- Communications equipment Support multi-channel I/O and buffering for link aggregation, protocol processing, and interface bridging in commercial communications gear.
- Video and imaging pipelines Provide the logic and embedded memory capacity needed for frame buffering, preprocessing, and custom video pipelines.
- Compute acceleration Deploy custom accelerators and datapaths that benefit from extensive programmable logic and local RAM to reduce external memory traffic.
Unique Advantages
- Large programmable fabric: Enables implementation of complex algorithms and extensive parallelism with approximately 622,000 logic elements.
- Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage needs.
- High I/O density: Up to 696 I/Os supports broad external connectivity and multi-channel interfacing without additional I/O expanders.
- Compact package: 1517-FBGA (40×40) FCBGA provides a high-pin-count solution in a compact surface-mount footprint for space-constrained PCBs.
- Commercial temperature grade: Rated 0 °C to 85 °C to meet the environmental needs of mainstream commercial deployments.
- Regulatory alignment: RoHS compliance supports environmental requirements for commercial product manufacturing.
Why Choose 5SGXEA7K1F40C1N?
The 5SGXEA7K1F40C1N combines large logic capacity, significant embedded memory, and a high number of I/Os in a compact 1517-FBGA package, making it well suited for designers building complex commercial systems that require integrated, programmable hardware resources. Its commercial temperature rating and RoHS compliance align with mainstream product development requirements and manufacturing practices.
This part is appropriate for engineering teams developing high-density digital processing, communications, video, or compute-acceleration applications that need substantial on-chip resources and predictable power and thermal characteristics from a surface-mount FPGA solution.
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