5SGXEA7K1F40C1N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 371 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K1F40C1N – Stratix® V GX FPGA, 622,000 logic elements, 1517-FBGA

The 5SGXEA7K1F40C1N is a Stratix® V GX field programmable gate array (FPGA) in a 1517-ball FCBGA package designed for commercial-temperature applications. It integrates a large logic fabric, substantial on-chip RAM, and a high I/O count to address complex, high-density digital designs.

This device is aimed at systems that require extensive programmable logic capacity and memory within a surface-mount FPGA package while operating over a commercial temperature range and a nominal core supply of 0.87–0.93 V.

Key Features

  • Core Logic  Approximately 622,000 logic elements for implementing large-scale digital logic, custom accelerators, and complex state machines.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage for high-throughput designs.
  • I/O Capacity  Up to 696 I/O pins to enable wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
  • Power  Core supply voltage specified at 0.870 V to 0.930 V, enabling predictable power budgeting and supply design.
  • Package & Mounting  1517-BBGA / 1517-FBGA (40×40) FCBGA surface-mount package for compact, high-density PCB implementations.
  • Operating Range  Commercial-grade operation from 0 °C to 85 °C to suit a wide range of commercial and industrial-adjacent applications.
  • Compliance  RoHS compliant for environmental and regulatory alignment in commercial product designs.

Typical Applications

  • High-density digital systems  Implement large logic designs and programmable datapaths where a high logic element count and significant on-chip RAM are required.
  • Communications equipment  Support multi-channel I/O and buffering for link aggregation, protocol processing, and interface bridging in commercial communications gear.
  • Video and imaging pipelines  Provide the logic and embedded memory capacity needed for frame buffering, preprocessing, and custom video pipelines.
  • Compute acceleration  Deploy custom accelerators and datapaths that benefit from extensive programmable logic and local RAM to reduce external memory traffic.

Unique Advantages

  • Large programmable fabric: Enables implementation of complex algorithms and extensive parallelism with approximately 622,000 logic elements.
  • Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage needs.
  • High I/O density: Up to 696 I/Os supports broad external connectivity and multi-channel interfacing without additional I/O expanders.
  • Compact package: 1517-FBGA (40×40) FCBGA provides a high-pin-count solution in a compact surface-mount footprint for space-constrained PCBs.
  • Commercial temperature grade: Rated 0 °C to 85 °C to meet the environmental needs of mainstream commercial deployments.
  • Regulatory alignment: RoHS compliance supports environmental requirements for commercial product manufacturing.

Why Choose 5SGXEA7K1F40C1N?

The 5SGXEA7K1F40C1N combines large logic capacity, significant embedded memory, and a high number of I/Os in a compact 1517-FBGA package, making it well suited for designers building complex commercial systems that require integrated, programmable hardware resources. Its commercial temperature rating and RoHS compliance align with mainstream product development requirements and manufacturing practices.

This part is appropriate for engineering teams developing high-density digital processing, communications, video, or compute-acceleration applications that need substantial on-chip resources and predictable power and thermal characteristics from a surface-mount FPGA solution.

Request a quote or submit a pricing/availability inquiry to receive lead-time and purchasing information for 5SGXEA7K1F40C1N.

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