5SGXEA7K1F35C2N

The 5SGXEA7K1F35C2N is a Stratix V GX field programmable gate array (FPGA) from Intel, offered in a commercial temperature grade. It provides a high-density programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of embedded memory, targeted at designs requiring large logic capacity and significant on-chip RAM.

Packaged in a 1152-BBGA (1152-FBGA, 35×35) surface-mount package with 432 I/O pins and a low-voltage core supply range of 0.87 V to 0.93 V, this device suits applications that need dense integration and robust I/O provisioning within commercial temperature environments.

Key Features

• Logic Capacity — 622,000 logic elements to implement complex FPGA designs and large-scale custom logic.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive algorithms.
• I/O Density — 432 programmable I/O pins, enabling broad peripheral interfacing and multi-protocol connectivity.
• Package & Mounting — 1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for high-density board layouts.
• Power — Core supply range of 870 mV to 930 mV (0.87 V–0.93 V) for the device core.
• Temperature Grade — Commercial operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant.
• Stratix V GX Family Characteristics — The Stratix V GX family datasheet documents electrical and switching characteristics, including I/O timing and transceiver speed grades (family listings include GX channel speeds up to 14.1 Gbps).

Typical Applications

• High-density custom logic — Implement complex state machines, custom datapaths, and hardware accelerators that require hundreds of thousands of logic elements.
• Memory-rich designs — Use the approximately 51.2 Mbits of embedded memory for buffering, packet queues, and large LUT-based structures.
• Multi-interface systems — Leverage 432 I/O pins for connecting multiple protocol interfaces, front-end sensors, or peripheral buses in a compact package.
• Prototyping and system integration — High logic and I/O density make the device suitable for board-level prototypes and integration of diverse subsystems in commercial products.

Unique Advantages

• High logic integration: 622,000 logic elements reduce the need for multiple devices, simplifying BOM and PCB routing for complex systems.
• Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory supports latency-sensitive buffering and local storage without external memory.
• Robust I/O count: 432 I/Os provide flexibility for large numbers of channels, enabling consolidation of multiple interfaces on a single FPGA.
• Compact high-pin package: 1152-FBGA (35×35) provides high I/O and ball density in a surface-mount form factor for space-constrained designs.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation, suitable for standard commercial electronics environments.
• RoHS compliant: Conforms to RoHS requirements for assembly in lead-free designs.

Why Choose 5SGXEA7K1F35C2N?

The 5SGXEA7K1F35C2N delivers a combination of large logic capacity, significant embedded memory, and dense I/O in a single commercial-grade Stratix V GX device. Its low-voltage core operation and 1152-ball FBGA package allow designers to integrate complex functions while keeping board area and component count under control.

This device is a fit for engineering teams building high-density, memory-intensive, and I/O-rich commercial applications that benefit from the documented electrical and switching characteristics of the Stratix V family. Backed by the Stratix V documentation set, the 5SGXEA7K1F35C2N provides the specification-level detail needed for system-level design and verification.

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