5SGXEA7K1F40C1G

The 5SGXEA7K1F40C1G is a Stratix V GX family field programmable gate array provided in a 1517-ball FCBGA package (40×40). This commercial-grade FPGA delivers high integration with 622,000 logic elements and substantial on-chip memory, enabling complex, high-density digital designs.

Designed for applications that require large logic capacity, extensive I/O, and robust package-level integration, this device balances dense programmable logic with a high I/O count and defined power and temperature operating envelopes for reliable board-level deployment.

Key Features

• Core Logic  622,000 logic elements and 234,720 LABs provide large programmable fabric for complex logic, control, and compute functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM (51,200,000 total RAM bits) for buffering, scratchpad storage, and memory-intensive algorithms.
• I/O Capacity  696 device I/O pins to support wide parallel interfaces, multi-channel routing, and dense board-level connectivity.
• Package  1517-BBGA FCBGA (supplier device package: 1517-FBGA, 40×40) for compact, high-pin-count implementations.
• Power  Core supply range specified at 870 mV to 930 mV to match board power-rail design and power-delivery planning.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial deployments.
• Mounting & Compliance  Surface-mount device, RoHS compliant to meet common environmental and assembly requirements.

Typical Applications

• High-density logic integration  Implement large-scale custom logic, control engines, and state machines that require extensive logic elements and LAB resources.
• On-chip buffering and memory-centric designs  Use the approximately 51.2 Mbits of embedded memory for packet buffering, frame storage, and intermediate data processing.
• High I/O interface hubs  Leverage 696 I/O pins for multi-lane parallel interfaces, wide data buses, or dense peripheral aggregation on a single FPGA.

Unique Advantages

• High integration density: Dense logic fabric (622,000 logic elements) reduces the need for multiple devices and simplifies system architecture.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM supports memory-heavy workloads without immediate dependency on external memory.
• Large I/O capacity: 696 I/Os allow flexible board-level connectivity and support for broad interface requirements.
• Compact, high-pin-count package: 1517-ball FCBGA (40×40) delivers high routing density in a compact footprint to save PCB area.
• Commercial-ready specification: Designed for commercial temperature ranges (0 °C to 85 °C) and RoHS compliance for mainstream product deployment.
• Defined power envelope: Core voltage range of 870 mV to 930 mV provides clear power-supply targets for system design.

Why Choose 5SGXEA7K1F40C1G?

The 5SGXEA7K1F40C1G combines a very large logic fabric with significant embedded memory and a high I/O count in a compact FCBGA package, making it suitable for designs that demand dense programmable resources and extensive board-level connectivity. Its commercial-grade specification and RoHS compliance enable straightforward integration into mainstream product lines.

This device is ideal for engineering teams building complex digital systems that require on-chip memory and high I/O without moving to multi-device solutions. The clear power and thermal operating ranges simplify system validation and deployment planning.

Request a quote or submit an inquiry to learn more about availability, lead times, and volume pricing for the 5SGXEA7K1F40C1G.