5SGXEA7K2F40C2WN

The 5SGXEA7K2F40C2WN is a Stratix® V GX field programmable gate array (FPGA) from Intel, designed for high-density logic implementations. It combines a large logic fabric with substantial on-chip memory and extensive I/O to address demanding embedded and board-level designs.

With 622,000 logic elements and approximately 51.2 Mbits of embedded memory, this surface-mount FCBGA device targets designs that require significant gate count, large local storage, and a high I/O count within a commercial temperature grade.

Key Features

• Logic Capacity  622,000 logic elements suitable for complex digital designs and large-scale logic integration.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for local data buffering, large lookup tables, and state storage.
• I/O Density  696 I/O pins to support multi‑lane interfaces, parallel data buses, and extensive board connectivity.
• Power Supply  Core voltage supply range of 870 mV to 930 mV to match system power architectures and regulator designs.
• Package & Mounting  1517-BBGA (1517-FBGA, 40×40) package; surface-mount construction for standard PCB assembly processes.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for mainstream electronics applications.
• Compliance  RoHS compliant, supporting regulatory-driven material requirements.

Typical Applications

• High-density signal processing  Use the large logic capacity and embedded RAM for real-time data processing, streaming algorithms, and DSP pipelines.
• I/O‑intensive systems  Leverage 696 I/Os for multi‑channel interfaces, parallel peripherals, and complex board-level interconnects.
• Prototyping and hardware emulation  Large logic and memory resources make the device suitable for validating complex SoC logic and hardware prototypes.
• Network and communications infrastructure  Deploy the device in systems that need substantial local logic and buffering for packet processing and protocol handling.

Unique Advantages

• High integration density: 622,000 logic elements and ~51.2 Mbits of embedded RAM reduce or eliminate the need for external glue logic and memory in many designs.
• Extensive board connectivity: 696 I/Os provide flexibility to support multiple interfaces and simplify PCB routing for complex systems.
• Standard assembly footprint: 1517-BBGA surface-mount package fits established PCB manufacturing flows and high-density board layouts.
• Commercial operating range: 0 °C to 85 °C and commercial grade classification align with mainstream electronics and industrial-adjacent applications.
• Predictable power window: Tight core voltage specification (870 mV–930 mV) aids in power-supply selection and stable core operation.
• RoHS compliant: Material compliance simplifies integration into products that require restricted-substance adherence.

Why Choose 5SGXEA7K2F40C2WN?

The 5SGXEA7K2F40C2WN delivers a combination of large logic capacity, substantial on-chip memory, and high I/O count in a single commercial‑grade FPG A package. It is well suited to engineering teams building complex digital systems that require dense integration and flexible I/O without sacrificing board-level simplicity.

Manufactured by Intel as part of the Stratix V family, this device benefits from comprehensive device documentation and proven silicon heritage. Choose this part when your design requires scalable logic resources, sizeable embedded RAM, and a high pin‑count package for advanced prototype and production applications.

Request a quote or submit an inquiry to get pricing and availability information for the 5SGXEA7K2F40C2WN.