5SGXEA7K2F40C3N

The 5SGXEA7K2F40C3N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel. It provides a high-density programmable fabric with large embedded memory and extensive I/O in a surface-mount FCBGA package.

Designed for designs that require significant logic capacity, on-chip RAM, and high-speed transceiver capability available in the Stratix V GX family, this commercial-grade device supports core voltages from 820 mV to 880 mV and operates across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core logic density — 622,000 logic elements to implement complex digital systems and large-scale programmable logic.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM for buffering, storage, and algorithm acceleration without external memory.
• I/O and package — 696 user I/Os in a 1517-BBGA (FCBGA) package; surface-mount mounting simplifies board-level integration. Supplier device package: 1517-FBGA (40×40).
• Stratix V GX transceiver capability — Device belongs to the Stratix V GX family; the family datasheet documents GX channel transceiver grades (including channels up to 14.1 Gbps for the GX family) for high-speed serial connectivity.
• Power supply — Core voltage range from 820 mV to 880 mV to match system power rails and design constraints.
• Commercial operating range — Rated for 0 °C to 85 °C operating temperature; commercial grade device.
• Compliance — RoHS compliant.

Typical Applications

• High-speed serial connectivity — Designs that leverage Stratix V GX transceivers for protocol bridging and high-bandwidth links.
• Complex digital systems — Implement large-scale state machines, datapaths, and custom hardware accelerators using the device’s high logic element count and embedded RAM.
• Deterministic I/O timing designs — Systems requiring precise I/O timing and periphery performance documented in the Stratix V device datasheet.

Unique Advantages

• High integration density: 622,000 logic elements and ~51.2 Mbits of embedded memory reduce the need for external components and simplify system architecture.
• Extensive I/O availability: 696 I/Os in a compact FCBGA footprint enable rich peripheral connectivity and multi-channel interfaces without additional I/O expanders.
• Family-level transceiver support: As a Stratix V GX device, it aligns with family transceiver specifications for high-speed serial channels, supporting designs that require high bandwidth links.
• Commercial temperature and RoHS compliance: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Surface-mount FCBGA package: The 1517-BBGA package and 1517-FBGA (40×40) supplier package enable dense PCB implementations suitable for advanced system boards.

Why Choose 5SGXEA7K2F40C3N?

The 5SGXEA7K2F40C3N provides a high-capacity Stratix V GX FPGA option for engineers building complex, high-performance digital systems that require substantial on-chip logic and memory alongside family-level transceiver capabilities. Its large I/O count and compact FCBGA package make it suitable for dense board designs where integration and predictable I/O timing matter.

Backed by Intel’s Stratix V device documentation, this commercial-grade FPGA offers a vetted platform for scalable designs that need programmable flexibility, embedded RAM, and the Stratix V GX transceiver feature set.

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