5SGXEA7K2F40I2

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 535 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K2F40I2 – Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

The 5SGXEA7K2F40I2 is a Stratix V GX field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers large programmable fabric, substantial embedded memory, and a high I/O count for industrial-grade designs.

This device is offered in an industrial temperature grade (‑40 °C to 100 °C) and operates from a core supply range of 870 mV to 930 mV, making it suitable for systems that require robust temperature tolerance and low-voltage core operation.

Key Features

  • Programmable Logic Capacity  Approximately 622,000 logic elements provide extensive on-chip logic resources for complex digital designs.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM (51,200,000 bits) supports large buffers, FIFOs, and data storage without external memory.
  • High I/O Count  696 user I/Os enable dense peripheral and board-level connectivity for multi-channel interfaces and wide parallel buses.
  • Package and Mounting  1517-BBGA (1517-FBGA, 40×40) ball grid array package in a surface-mount form factor for compact board integration.
  • Industrial Temperature Grade  Rated for operation from ‑40 °C to 100 °C to meet industrial environment requirements.
  • Low-Voltage Core Supply  Core supply range of 870 mV to 930 mV for efficient core operation.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Industrial control and automation  Industrial-rated temperature range and high logic density suit complex control, signal processing, and real-time automation tasks.
  • Communications infrastructure  As a Stratix V GX device, the family supports GX transceiver speed grades documented in the series datasheet, providing options for high-rate serial interfaces in networking equipment.
  • High-density embedded systems  Large embedded memory and abundant I/O enable designs that require on-chip buffering, parallel sensor arrays, or multi-channel interfacing.

Unique Advantages

  • Large programmable fabric: With approximately 622,000 logic elements, the device supports complex, multi-function FPGA designs on a single chip.
  • Substantial on-chip memory: Around 51.2 Mbits of embedded RAM reduces dependency on external memory and simplifies board-level design.
  • Extensive I/O capability: 696 I/Os provide flexibility for rich peripheral sets, wide buses, and multiple simultaneous interfaces.
  • Industrial robustness: Rated for operation from ‑40 °C to 100 °C to withstand demanding environmental conditions.
  • Compact, surface-mount package: 1517-BBGA (1517-FBGA, 40×40) packaging balances high pin count with a compact board footprint.
  • Low-voltage core operation: Narrow core supply window (870 mV–930 mV) suitable for power-aware system designs.

Why Choose 5SGXEA7K2F40I2?

The 5SGXEA7K2F40I2 Stratix V GX FPGA combines high logic capacity, significant on-chip RAM, and a large I/O complement in a surface-mount 1517-BBGA package rated for industrial temperatures. These attributes make it well suited to engineered systems that require dense programmable logic, on-chip data storage, and robust environmental tolerance.

Engineers building industrial controls, communications infrastructure, and other high-density embedded systems can leverage this device’s capacity and packaging to reduce external components, simplify board layout, and maintain operation across a wide temperature range.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXEA7K2F40I2 FPGA for your next design.

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