5SGXEA7K2F40C3WN

The 5SGXEA7K2F40C3WN is an Intel Stratix V GX family field programmable gate array (FPGA) designed for demanding programmable-logic applications. This device integrates a high logic density, substantial on-chip memory, and a large number of I/O pins to address designs that require complex custom logic and significant data buffering.

As part of the Stratix V GX series, the device is covered by the Stratix V device datasheet, which details electrical and switching characteristics including transceiver specifications and I/O timing. Key hardware attributes include approximately 622,000 logic elements, about 51.2 Mbits of embedded memory, and 696 user I/Os in a 1517-BBGA (FCBGA) package.

Key Features

• Core & Logic: Approximately 622,000 logic elements provide substantial programmable fabric for large-scale custom logic, state machines, and hardware accelerators.
• On‑Chip Memory: Approximately 51.2 Mbits of embedded memory for buffering, FIFOs, and local data storage within user designs.
• I/O Capacity: 696 user I/Os supporting high pin-count, I/O‑dense applications and complex board-level interfacing.
• Power Supply: Core supply range specified at 820 mV to 880 mV, enabling designs that target the device’s defined core-voltage window.
• Package & Mounting: 1517-BBGA (FCBGA) package, supplier package listed as 1517-FBGA (40×40), with surface-mount mounting type for PCB assembly.
• Operating Conditions & Grade: Commercial grade device rated for an operating temperature range of 0 °C to 85 °C.
• Standards Compliance: RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Custom hardware acceleration: Use the large logic element count and embedded memory to implement application-specific accelerators and offload compute tasks from processors.
• I/O‑dense systems and protocol bridging: The 696 user I/Os support high-pin-count interfacing, enabling protocol conversion and complex system I/O aggregation.
• Memory‑intensive logic: Designs requiring substantial on-chip buffering, temporary storage, or deep FIFOs can leverage the approximately 51.2 Mbits of embedded memory.
• Platform prototyping and integration: The FCBGA package and surface-mount mounting make the device suitable for compact, densely routed prototype and production PCBs.

Unique Advantages

• High logic density: Approximately 622,000 logic elements enable extensive custom logic implementation without immediate migration to larger families.
• Significant on‑chip memory: About 51.2 Mbits of embedded RAM reduces external memory needs for many buffering and intermediate-storage tasks.
• Extensive I/O availability: 696 user I/Os give designers flexibility for parallel interfaces, multiple peripherals, and board-level routing options.
• Compact BGA packaging: The 1517-BBGA FCBGA footprint provides a high-pin-count solution in a compact form factor suitable for dense PCB layouts.
• Defined operating supply and temperature: Clear specification of core voltage (820 mV–880 mV) and commercial temperature range (0 °C–85 °C) simplifies power and thermal planning.
• RoHS compliant: Meets common environmental requirements for lead-free assembly and regulatory compliance.

Why Choose 5SGXEA7K2F40C3WN?

The 5SGXEA7K2F40C3WN positions itself where high logic capacity, significant embedded memory, and large I/O count are required in a commercial-temperature FPGA. Its specification set supports complex programmable designs that demand on-chip resources and a high number of external connections while fitting into a compact BGA package.

Engineers building hardware accelerators, protocol bridging solutions, or I/O-heavy platforms benefit from the device’s density and memory. Backed by the Stratix V family documentation covering electrical and switching characteristics, the device is suitable for teams that need verifiable specs for power, I/O timing, and integration planning.

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