5SGXEA7K2F40C3

The 5SGXEA7K2F40C3 is a Stratix V GX field programmable gate array (FPGA) offered in a 1517‑BBGA FCBGA package. It delivers high logic capacity and substantial on‑chip memory in a commercial temperature grade, targeting complex, high‑density digital designs.

Key use cases include designs that require large programmable logic resources, significant embedded RAM, and a high I/O count. As a member of the Stratix V family, the device is aligned with the series' electrical and I/O timing characteristics documented in the Stratix V device datasheet.

Key Features

• High‑density logic  622,000 logic elements suitable for large-scale digital implementations and complex state machines.
• Embedded memory  Approximately 51 Mbits of on‑chip RAM for buffering, packet processing, and data staging.
• I/O density  696 user I/Os to support wide parallel interfaces and extensive peripheral connectivity.
• Power/core voltage  Core supply operates in the 820 mV to 880 mV range.
• Package and mounting  1517‑BBGA FCBGA package (supplier package: 1517‑FBGA, 40×40), surface mount for high‑density board designs.
• Operating environment  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Standards compliance  RoHS compliant for lead‑free hardware requirements.
• Stratix V family characteristics  Device conforms to the Stratix V family electrical and switching characteristics, including documented I/O timing and programmable I/O element behavior in the Stratix V device datasheet.

Typical Applications

• High‑performance communications  Large logic capacity and the Stratix V GX family characteristics make the device suitable for designs that require substantial on‑chip processing alongside high‑speed transceiver capability at the family level.
• Data processing and acceleration  Ample logic and approximately 51 Mbits of embedded RAM support compute offload, packet processing, and parallel data paths.
• Signal processing and imaging  High logic density and on‑chip memory enable complex DSP pipelines, image pre‑processing, and multichannel processing tasks.
• System integration and prototyping  Large I/O count and compact BGA packaging allow integration of multiple interfaces and rapid development of system prototypes.

Unique Advantages

• Large programmable fabric: 622,000 logic elements provide the headroom to implement complex algorithms and extensive custom logic without immediate migration to larger device families.
• Substantial on‑chip RAM: Approximately 51 Mbits of embedded memory reduces dependence on external memory for many buffering and staging use cases, simplifying board design.
• Extensive I/O capability: 696 I/Os accommodate broad peripheral connectivity and wide parallel data buses, reducing external multiplexing needs.
• Compact BGA footprint: 1517‑BBGA (40×40) package supports high routing density while conserving PCB area for complex systems.
• Commercial temperature range: Rated 0 °C to 85 °C for standard commercial deployments where this ambient range is required.
• Regulatory compliance: RoHS compliance supports environmental and manufacturability requirements for lead‑free assemblies.

Why Choose 5SGXEA7K2F40C3?

The 5SGXEA7K2F40C3 is positioned for designers who need a high‑capacity Stratix V GX FPGA with substantial on‑chip RAM and a large I/O complement in a compact BGA package. Its combination of 622,000 logic elements, approximately 51 Mbits of embedded memory, and 696 I/Os makes it suitable for advanced communications, data processing, and signal‑intensive applications within commercial temperature environments.

As a member of the Stratix V family, the device aligns with the series' documented electrical and I/O timing characteristics, making it a practical choice for teams leveraging Stratix V design flows and family‑level documentation to manage complexity and deployment timelines.

Request a quote or submit a pricing inquiry today to receive up‑to‑date availability and lead‑time information for the 5SGXEA7K2F40C3.