5SGXEA7K2F40I2L

The 5SGXEA7K2F40I2L is a high-density Stratix® V GX FPGA from Intel designed for complex, configurable digital logic implementations. This device integrates a large logic fabric, substantial embedded memory, and a very high I/O count in a compact FCBGA package for industrial-grade applications.

With 622,000 logic elements and approximately 51.2 Mbits of embedded memory, the device targets designs that require high logic capacity, extensive on-chip buffering, and large interface counts while operating across an industrial temperature range.

Key Features

• High Logic Capacity — 622,000 logic elements provide a large programmable fabric for complex RTL implementations and system-level integration.
• On‑Chip Memory — Approximately 51.2 Mbits of embedded memory for large data buffering, FIFOs, and storage tightly coupled to logic.
• Extensive I/O — 696 user I/O pins to support wide parallel interfaces, multiple peripherals, and high‑pin-count board designs.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C to meet demanding environmental requirements.
• Low-Voltage Core Supply — Voltage supply specified at 820 mV to 880 mV for the core domain.
• Package and Mounting — 1517-BBGA (FCBGA) package, supplier package 1517-FBGA (40×40); surface-mount device for modern PCB assembly.
• Standards Compliance — RoHS compliant for environmental and regulatory alignment.
• Series Documentation — Device is part of the Stratix V GX family; the series datasheet includes electrical and switching characteristics useful for system-level planning.

Typical Applications

• High‑density digital systems — Implement complex datapaths, custom accelerators, and large finite-state machines using extensive logic and embedded memory.
• High‑I/O interface hubs — Aggregate and route signals from numerous peripherals or parallel buses using the device’s 696 I/O pins.
• Industrial control and automation — Deploy in systems that require industrial temperature range operation and robust on‑chip resources.
• Embedded compute and buffering — Use the sizable on‑chip memory for buffering, packet processing, and real‑time data handling.

Unique Advantages

• Significant integration — High logic element count and large embedded memory reduce the need for external ASICs or discrete logic, simplifying BOM and board area.
• High interface density — Nearly 700 I/Os enable complex connectivity and multi‑channel designs without extensive external multiplexing.
• Industrial robustness — Specified –40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact FCBGA package — 1517-BBGA (40×40) packaging delivers a dense footprint for space-constrained systems while supporting surface-mount assembly.
• Controlled core power domain — Narrow core voltage range (820–880 mV) aids predictable power budgeting for system design.
• Regulatory alignment — RoHS compliance facilitates integration into modern manufacturing and supply chains.

Why Choose 5SGXEA7K2F40I2L?

The 5SGXEA7K2F40I2L positions itself as a high-capacity Stratix V GX FPGA suited to designs that demand a large programmable fabric, extensive on‑chip memory, and a very high I/O count within an industrial temperature envelope. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 I/Os makes it appropriate for complex digital processing, interface aggregation, and embedded acceleration tasks.

Backed by Intel’s Stratix V family documentation, this device is a pragmatic choice for engineering teams seeking scalability, predictable power characteristics, and compliance with RoHS requirements in demanding environments.

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