5SGXEA7K2F40I2N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 330 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K2F40I2N – Stratix® V GX FPGA, 696 I/Os, approximately 51.2 Mbit RAM

The 5SGXEA7K2F40I2N is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers high logic and I/O capacity—622,000 logic elements and 696 I/Os—along with approximately 51.2 Mbits of embedded memory for demanding programmable-logic applications.

Designed for industrial-grade environments, this device supports a core supply voltage range of 870 mV to 930 mV and an operating temperature range from -40 °C to 100 °C, making it suitable for robust, high-density designs that require large on-chip resources and wide I/O counts.

Key Features

  • Core Capacity  Provides 622,000 logic elements, enabling implementation of complex custom logic and large-scale compute fabrics.
  • Logic Array Blocks  Includes 234,720 logic array blocks for structured resource partitioning and design scalability.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, large FIFOs, and memory-intensive algorithms without external memory dependence.
  • I/O Resources  696 differential and single‑ended I/Os to support wide parallel interfaces, multi-protocol connectivity, and high pin-count system integration.
  • Package  1517-BBGA (FCBGA) supplier device package 1517-FBGA (40×40) for dense board-level integration and reliable solder mounting.
  • Power  Core voltage supply specified between 870 mV and 930 mV to enable consistent power budgeting and design margining.
  • Thermal & Grade  Industrial temperature grade with an operating range of -40 °C to 100 °C for extended-environment deployments.
  • Mounting  Surface-mount package compatible with standard board-assembly processes.
  • Compliance  RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

  • High-density digital signal processing  Use the large logic element count and substantial embedded memory to implement complex DSP pipelines and large parallel processing blocks.
  • Custom hardware acceleration  Leverage the high logic capacity and abundant I/Os for FPGA-based accelerators and offload engines in compute systems.
  • Interface bridging and protocol translation  The extended I/O count supports multi-protocol gateway designs and high-pin-count peripheral interfacing.

Unique Advantages

  • High logic density: 622,000 logic elements provide the headroom to implement large, integrated designs without immediate need for multiple FPGAs.
  • Large on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependency and simplifies board-level BOM and routing.
  • Extensive I/O capacity: 696 I/Os enable broad connectivity for multi-lane interfaces, multiple peripherals, and wide parallel buses.
  • Industrial-ready thermal range: Rated for -40 °C to 100 °C operation to support deployments in harsh or temperature-variable environments.
  • Compact, high-density package: 1517-BBGA FCBGA (supplier 1517-FBGA 40×40) balances pin count and board area for dense system integration.
  • Regulatory readiness: RoHS compliance simplifies environmental qualification in end products.

Why Choose 5SGXEA7K2F40I2N?

The 5SGXEA7K2F40I2N combines very large logic capacity, substantial embedded memory, and an expansive I/O complement in an industrial-grade Stratix V GX FPGA package. Its electrical and thermal specifications support robust system designs that demand on-chip resources and wide interfacing capability.

This device is ideal for engineering teams building complex, high-density programmable logic systems where integration, scalability, and environmental robustness are required. Its combination of resources helps reduce external components and supports long-term design scalability within the Stratix V family specification framework.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5SGXEA7K2F40I2N.

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