5SGXEA7K2F40I3

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 1,599 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K2F40I3 – Stratix® V GX FPGA, 622k logic elements, ~51.2 Mbit RAM, 696 I/O, 1517-BBGA

The 5SGXEA7K2F40I3 is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package. It delivers a high logic capacity combined with ample on‑chip memory and a large number of user I/O pins, making it suitable for high-density, industrial-temperature designs.

This device is designed for applications that require significant programmable logic, integrated embedded memory, and extensive I/O while operating across an industrial temperature range. Key electrical characteristics include a nominal core supply range of 820 mV to 880 mV and guaranteed operation from –40 °C to 100 °C.

Key Features

  • High Logic Capacity 622,000 logic elements to support complex combinational and sequential logic implementations.
  • Embedded Memory Approximately 51.2 Mbits of on‑chip RAM for data buffering, local storage, and block‑level memory requirements.
  • Extensive I/O 696 user I/O pins available for broad interfacing options with external peripherals and signaling domains.
  • Power and Core Supply Core voltage supply specified from 820 mV to 880 mV to match system power design requirements.
  • Package and Mounting 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface mount form factor for board-level integration.
  • Industrial Temperature Grade Qualified for operation from –40 °C to 100 °C for deployment in industrial environments.
  • Regulatory Compliance RoHS compliant, supporting lead‑free assembly and regulatory requirements for many OEMs.

Typical Applications

  • High‑density signal processing — Use the device’s large logic and memory resources for DSP, video, or imaging pipelines that require on‑chip buffering and processing.
  • Network and communications systems — Leverage the plentiful I/O and logic capacity for packet processing, framing, and protocol handling in network equipment.
  • Data acceleration and compute offload — Implement custom accelerators and hardware offloads that need large amounts of configurable logic and embedded RAM.
  • Industrial control and instrumentation — Deploy in control systems that require reliable operation across an extended temperature range and numerous I/O connections.

Unique Advantages

  • Substantial programmable logic: 622,000 logic elements enable complex system-on-chip implementations and large-scale custom logic blocks.
  • Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependency on external memory for latency‑sensitive functions.
  • Broad I/O connectivity: 696 user I/O pins provide flexible interfacing to multiple peripherals and I/O domains, simplifying board design.
  • Industrial robustness: Rated for –40 °C to 100 °C operation for deployment in demanding environments.
  • Compact package integration: 1517‑BBGA FCBGA surface mount package supports dense board layouts while maintaining high pin count.
  • RoHS compliant: Meets lead‑free requirements for modern manufacturing and regulatory needs.

Why Choose 5SGXEA7K2F40I3?

The 5SGXEA7K2F40I3 combines high logic density, substantial embedded memory, and a large I/O complement in a single industrial‑grade Stratix® V GX FPGA. Its package and electrical specifications make it appropriate for designers building complex, high‑capacity programmable systems that must operate reliably across extended temperature ranges.

This device suits teams and projects that require scalable logic resources, integrated RAM for data‑intensive tasks, and wide interface capability—offering a foundation for custom accelerators, signal processing engines, and communication subsystems while aligning with RoHS requirements.

Request a quote or submit an inquiry for 5SGXEA7K2F40I3 to check pricing and availability for your next design.

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