5SGXEA7K2F40I2W

The 5SGXEA7K2F40I2W is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel. It delivers a high logic capacity FPGA fabric with substantial embedded memory and a large I/O count in a 1517-BBGA (40×40) FCBGA package for surface-mount assembly.

Designed for applications that require high-density logic, abundant on-chip RAM and robust I/O, this industrial-grade device supports operation across a wide temperature range and a low-voltage core supply, making it suitable for demanding embedded and communications designs.

Key Features

• High Logic Capacity — 622,000 logic elements to implement large, complex digital systems and custom accelerators.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive algorithms.
• Extensive I/O — 696 user I/Os to support dense peripheral connectivity, parallel interfaces, and board-level routing flexibility.
• Industrial Grade & Temperature Range — Rated for industrial operation with an operating temperature range of –40°C to 100°C.
• Low-Voltage Core Supply — Core voltage supply specified from 870 mV to 930 mV for optimized core power delivery.
• Package & Mounting — 1517-BBGA (FCBGA), supplier package 1517-FBGA (40×40); surface-mount package suitable for board-level integration.
• RoHS Compliant — Meets RoHS requirements for regulatory compliance.
• Stratix V GX Family Transceiver Capability (series) — Stratix V GX family documentation lists transceiver speed grades up to 14.1 Gbps depending on speed grade (family-level information).

Typical Applications

• High-density digital processing — Large logic capacity and substantial embedded RAM support FPGA-based signal processing, data path acceleration, and complex control logic.
• Communications and networking — High I/O count and Stratix V GX family transceiver speed grades support implementations requiring extensive board-level interfaces and high-speed serial links (family-level capability).
• Embedded system integration — Surface-mount 1517-BBGA package and broad operating temperature range suit rugged embedded platforms requiring compact, thermally stable FPGA solutions.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable consolidation of multiple functions onto a single device, reducing board complexity.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and algorithmic needs.
• High connectivity: 696 I/Os provide flexibility for parallel interfaces, wide buses, and dense I/O configurations without external expander chips.
• Industrial temperature rating: –40°C to 100°C operation supports deployment in harsh or temperature-variable environments.
• Compact, production-ready package: 1517-BBGA (40×40) surface-mount FCBGA package simplifies production mounting and board layout for high-density systems.
• Standards-compliant supply and environmental profile: Core supply specified between 870 mV and 930 mV and RoHS compliance aid integration and regulatory alignment.

Why Choose 5SGXEA7K2F40I2W?

The 5SGXEA7K2F40I2W combines a very large logic fabric with substantial embedded memory and an extensive I/O complement in an industrial-grade, surface-mount FCBGA package. It is suited for engineers building high-density FPGA-based systems requiring on-chip resources to minimize external components while maintaining broad operating temperature capability.

This device is appropriate for designs that demand scalability and integration—delivering significant on-chip resources to support complex data processing, communications front-ends, or integrated system functions—and benefits from Intel’s Stratix V GX family documentation and device-level electrical specifications.

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