5SGXEA7K2F40I3G

The 5SGXEA7K2F40I3G is a Stratix® V GX field-programmable gate array (FPGA) IC optimized for high-density, high-throughput digital designs. As a member of the Stratix V GX family, it provides a large logic fabric, substantial on-chip memory, and a high I/O count to address complex system integration needs.

This device suits applications that require extensive programmable logic, significant embedded memory, and broad external interfacing while operating across industrial temperature ranges and low-voltage core supply rails.

Key Features

• Logic Capacity  622,000 logic elements (cells) provide a large programmable fabric for complex custom logic, data-paths, and control implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, large lookup tables, and state storage without external memory for many use cases.
• I/O Density  696 I/Os for wide parallel interfaces, multiple peripheral connections, and high-channel count systems.
• Core Voltage  Low-voltage core supply range from 820 mV to 880 mV for designs targeting energy-efficient core operation.
• Package & Mounting  1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount format for high-density board assemblies.
• Industrial Temperature Grade  Rated for –40 °C to 100 °C operation for reliable performance in demanding environments.
• RoHS Compliant  Meets RoHS environmental requirements for modern manufacturing and deployment.

Typical Applications

• High-density signal processing  Large logic capacity and substantial on-chip RAM enable complex DSP pipelines and dataflow processing inside the FPGA fabric.
• Network and data plane acceleration  High I/O count and sizable logic resources support packet processing, custom protocol handling, and parallel I/O architectures.
• SoC prototyping and system integration  Abundant logic elements and memory make the device suitable for prototyping large-scale embedded systems and consolidating multiple functions on a single FPGA.

Unique Advantages

• High programmable capacity: 622,000 logic elements provide headroom for complex finite-state machines, datapaths, and custom accelerators without partitioning across multiple devices.
• Large embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage needs, simplifying board-level design.
• Extensive I/O: 696 I/Os allow direct connection to numerous peripherals, buses, and parallel interfaces, streamlining system integration.
• Industrial-grade thermal range: Rated –40 °C to 100 °C for deployment in environments requiring extended temperature tolerance.
• Compact, board-ready package: 1517-BBGA (1517-FBGA, 40×40) surface-mount package supports high-density PCBs and modern assembly processes.
• Regulatory readiness: RoHS compliance supports environmentally responsible manufacturing and distribution.

Why Choose 5SGXEA7K2F40I3G?

The 5SGXEA7K2F40I3G combines a large logic fabric, substantial on-chip RAM, and high I/O density in an industrial-temperature, surface-mount BBGA package. Its low-voltage core operation and RoHS compliance make it suitable for designs that require efficient core power, significant integration, and environmental compliance.

This device is well suited for engineering teams building complex signal-processing, networking, and system-prototyping applications that demand scalable logic resources, embedded memory, and broad external connectivity while maintaining operation across extended temperature ranges.

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