5SGXEA7K2F40I3LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 105 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7K2F40I3LN – Stratix® V GX Field Programmable Gate Array (FPGA), 622,000 logic elements
The 5SGXEA7K2F40I3LN is an industrial-grade Stratix® V GX Field Programmable Gate Array (FPGA) offered in a 1517-BBGA FCBGA package. It provides a high-density programmable fabric with 622,000 logic elements and a large on-chip memory resource for complex digital designs.
Designed for systems requiring substantial I/O and memory capacity, this device supports 696 I/O pins, operates from a core supply of 820 mV to 880 mV, and is specified for operation between –40 °C and 100 °C. The device is RoHS compliant and supplied in a 1517-FBGA (40×40) surface-mount package.
Key Features
- Core Architecture Stratifix V GX FPGA fabric offering 622,000 logic elements to implement large-scale logic and custom accelerators.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and data storage close to logic.
- I/O Density 696 user I/Os suitable for multi-channel interfaces, parallel buses, and high-pin-count systems.
- Power and Voltage Core voltage supply specified from 820 mV to 880 mV, enabling defined low-voltage core operation.
- Package & Mounting 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount mounting type for board-level integration.
- Temperature & Grade Industrial grade with an operating temperature range of –40 °C to 100 °C for demanding environments.
- Compliance RoHS compliant to support lead-free manufacturing and regulatory requirements.
Typical Applications
- Industrial Control & Automation Industrial-grade specification and wide operating temperature range make this device suitable for control systems and industrial equipment with high logic and I/O requirements.
- High-density Logic Implementation Large logic element count and significant embedded memory enable complex state machines, data processing pipelines, and custom compute blocks.
- High-I/O Systems 696 I/Os support multi-protocol interfaces, parallel data lanes, and extensive peripheral connectivity in communication or instrumentation equipment.
Unique Advantages
- High programmable density: 622,000 logic elements provide capacity for large, integrated designs and reduce the need for multiple devices.
- Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory helps keep latency-sensitive data local to logic, simplifying board-level memory architectures.
- Extensive I/O count: 696 I/Os accommodate complex interfacing without external I/O expanders, reducing BOM and board complexity.
- Industrial-rated operation: Specified –40 °C to 100 °C operation and industrial grade support deployment in harsher environments and extended-temperature applications.
- Compact surface-mount package: 1517-FBGA (40×40) packaging provides a high-pin-count solution in a space-efficient form factor for dense board layouts.
- Regulatory readiness: RoHS compliance aligns with lead-free manufacturing processes and environmental requirements.
Why Choose 5SGXEA7K2F40I3LN?
The 5SGXEA7K2F40I3LN sits at the intersection of high logic density, large embedded memory, and extensive I/O capability—assembled in a compact FCBGA package and rated for industrial operation. These attributes make it well suited to engineers building complex digital systems where consolidation of functions into a single FPGA reduces board-level complexity.
With clearly specified core voltage range, I/O count, memory size, and temperature rating, this Stratix V GX device offers predictable electrical and thermal characteristics for production designs that demand scalability and robustness within an industrial product lifecycle.
Request a quote or submit an inquiry for the 5SGXEA7K2F40I3LN to check pricing and availability for your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018