5SGXEA7K2F40I3LN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 105 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K2F40I3LN – Stratix® V GX Field Programmable Gate Array (FPGA), 622,000 logic elements

The 5SGXEA7K2F40I3LN is an industrial-grade Stratix® V GX Field Programmable Gate Array (FPGA) offered in a 1517-BBGA FCBGA package. It provides a high-density programmable fabric with 622,000 logic elements and a large on-chip memory resource for complex digital designs.

Designed for systems requiring substantial I/O and memory capacity, this device supports 696 I/O pins, operates from a core supply of 820 mV to 880 mV, and is specified for operation between –40 °C and 100 °C. The device is RoHS compliant and supplied in a 1517-FBGA (40×40) surface-mount package.

Key Features

  • Core Architecture  Stratifix V GX FPGA fabric offering 622,000 logic elements to implement large-scale logic and custom accelerators.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and data storage close to logic.
  • I/O Density  696 user I/Os suitable for multi-channel interfaces, parallel buses, and high-pin-count systems.
  • Power and Voltage  Core voltage supply specified from 820 mV to 880 mV, enabling defined low-voltage core operation.
  • Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount mounting type for board-level integration.
  • Temperature & Grade  Industrial grade with an operating temperature range of –40 °C to 100 °C for demanding environments.
  • Compliance  RoHS compliant to support lead-free manufacturing and regulatory requirements.

Typical Applications

  • Industrial Control & Automation  Industrial-grade specification and wide operating temperature range make this device suitable for control systems and industrial equipment with high logic and I/O requirements.
  • High-density Logic Implementation  Large logic element count and significant embedded memory enable complex state machines, data processing pipelines, and custom compute blocks.
  • High-I/O Systems  696 I/Os support multi-protocol interfaces, parallel data lanes, and extensive peripheral connectivity in communication or instrumentation equipment.

Unique Advantages

  • High programmable density: 622,000 logic elements provide capacity for large, integrated designs and reduce the need for multiple devices.
  • Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory helps keep latency-sensitive data local to logic, simplifying board-level memory architectures.
  • Extensive I/O count: 696 I/Os accommodate complex interfacing without external I/O expanders, reducing BOM and board complexity.
  • Industrial-rated operation: Specified –40 °C to 100 °C operation and industrial grade support deployment in harsher environments and extended-temperature applications.
  • Compact surface-mount package: 1517-FBGA (40×40) packaging provides a high-pin-count solution in a space-efficient form factor for dense board layouts.
  • Regulatory readiness: RoHS compliance aligns with lead-free manufacturing processes and environmental requirements.

Why Choose 5SGXEA7K2F40I3LN?

The 5SGXEA7K2F40I3LN sits at the intersection of high logic density, large embedded memory, and extensive I/O capability—assembled in a compact FCBGA package and rated for industrial operation. These attributes make it well suited to engineers building complex digital systems where consolidation of functions into a single FPGA reduces board-level complexity.

With clearly specified core voltage range, I/O count, memory size, and temperature rating, this Stratix V GX device offers predictable electrical and thermal characteristics for production designs that demand scalability and robustness within an industrial product lifecycle.

Request a quote or submit an inquiry for the 5SGXEA7K2F40I3LN to check pricing and availability for your next design.

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