5SGXEA7K2F40I3WN

The 5SGXEA7K2F40I3WN is a Stratix® V GX field programmable gate array (FPGA) IC engineered for designs that require very large logic capacity, abundant I/O, and significant on-chip memory. It integrates 622,000 logic elements and approximately 51.2 Mbits of embedded memory to address complex digital processing tasks.

Built and specified for industrial use, this surface-mount FCBGA device provides a broad operating range and a compact 1517-BBGA package footprint, making it suitable for industrial communication, high-density signal processing, and advanced embedded systems that demand robust thermal and voltage operating margins.

Key Features

• Logic Capacity — 622,000 logic elements to implement large-scale digital designs and complex algorithmic functions.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, look-up tables, and data-path storage.
• I/O Density — 696 device I/Os to support wide parallel interfaces, high-pin-count connectivity, and flexible board integration.
• Power and Core Voltage — Core supply specified from 820 mV to 880 mV, enabling integration into systems designed around low-voltage FPGA cores.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package and Mounting — 1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for compact PCB designs.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• High-density digital signal processing — Implements large DSP chains and parallel processing engines leveraging the device's logic and memory resources.
• Industrial control and automation — Supports complex control algorithms and extensive I/O counts within industrial temperature ranges.
• Network and communications infrastructure — Provides the logic capacity and I/O required for packet processing, protocol handling, and custom interface bridging.
• Advanced embedded systems — Enables system-level integration where on-chip memory and high logic counts reduce external component requirements.

Unique Advantages

• Large on-chip logic pool: 622,000 logic elements allow integration of complex functions that would otherwise require multiple devices, reducing system BOM and board complexity.
• Substantial embedded memory: Approximately 51.2 Mbits of RAM provides on-chip buffering and storage for high-throughput processing and reduced external memory dependence.
• High I/O count: 696 I/Os enable wide parallel interfaces and flexible connectivity options for multi-channel systems.
• Industrial-grade thermal range: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• Compact FCBGA package: The 1517-BBGA (1517-FBGA, 40×40) package delivers high density in a surface-mount form factor suitable for space-constrained PCBs.
• Low-voltage core operation: Core supply range of 820 mV–880 mV aligns with low-voltage FPGA system designs.

Why Choose 5SGXEA7K2F40I3WN?

The 5SGXEA7K2F40I3WN places substantial programmable resources—622,000 logic elements and approximately 51.2 Mbits of embedded memory—into a single industrial-grade FCBGA package with 696 I/Os. Its combination of logic density, on-chip memory, and high I/O count makes it well suited to designs that demand integration, parallel processing, and robust thermal performance.

For engineering teams building complex industrial, communication, or high-performance embedded systems, this Stratix V GX device provides a scalable platform that reduces external component needs and supports long-term design stability backed by the Stratix V device family specifications.

Request a quote or submit your design requirements to obtain pricing and availability for the 5SGXEA7K2F40I3WN.