5SGXEA7K3F35C2

The 5SGXEA7K3F35C2 is a Stratix® V GX Field Programmable Gate Array (FPGA) supplied in a 1152-FBGA (35×35) surface-mount package. It delivers high logic capacity, large on-chip memory, and extensive I/O in a commercial-temperature FPGA offering from the Stratix V GX family.

Designed for commercial-grade designs that require high-density programmable logic and transceiver-capable architecture, this device provides a balance of integration, I/O connectivity, and low-voltage core operation for advanced digital systems.

Key Features

• Core & logic capacity  Provides 622,000 logic elements for complex, high-density logic implementations.
• Embedded memory  Includes approximately 51.2 Mbits of on-chip RAM to support large buffering and local data storage.
• I/O density  Offers 432 user I/Os to support broad peripheral connectivity and multi-channel interfacing.
• Package & mounting  Supplied in a 1152-BBGA / 1152-FBGA (35×35) FCBGA surface-mount package suitable for compact, board-level integration.
• Power & voltage  Core voltage supply range is 870 mV to 930 mV for low-voltage operation.
• Temperature & grade  Commercial temperature grade with an operating range of 0°C to 85°C.
• Standards compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Large logic element count and on-chip memory make this device suitable for complex programmable logic tasks and system integration on a single FPGA.
• High-performance I/O interfaces  With 432 I/Os, the device supports multi-channel interfacing and dense peripheral connectivity for advanced boards and modules.
• Transceiver-capable designs  As a Stratix V GX family device, it fits applications that leverage the GX transceiver architecture available within the family for high-speed serial links.

Unique Advantages

• High logic density: 622,000 logic elements enable implementation of sizable logic networks and complex algorithms on a single device.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependence and improves system performance.
• Extensive I/O availability: 432 I/Os provide flexibility for interfacing multiple peripherals, sensors, and subsystems without external multiplexing.
• Compact, high-pincount package: 1152-FBGA (35×35) packaging delivers high I/O and routing density in a surface-mount form factor.
• Low-voltage core operation: 870 mV–930 mV core supply allows integration into low-voltage power domains.
• Commercial temperature rating: Operates across a 0°C–85°C range for standard commercial applications.

Why Choose 5SGXEA7K3F35C2?

The 5SGXEA7K3F35C2 combines a very large logic element count, substantial embedded memory, and a high I/O count in a compact 1152-FBGA package—making it a strong option for commercial designs that require dense programmable logic, significant on-chip storage, and broad connectivity. As a member of the Stratix V GX family, it aligns with designs that may leverage the family’s transceiver-capable architecture.

This device is well suited to engineers and system integrators building complex digital systems where integration, I/O density, and on-chip memory are priorities. Design teams can rely on the Stratix V family documentation and device specifications for implementation guidance and system planning.

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