5SGXEA7K3F35C2LG

The 5SGXEA7K3F35C2LG is a Stratix® V GX field programmable gate array (FPGA) in a 1152‑ball BGA (FCBGA) package. It delivers very high logic capacity and on‑chip memory while providing a large number of I/O pins for complex, I/O‑intensive commercial designs.

Targeted at commercial applications that require high-density programmable logic and abundant embedded memory, this device offers integration and scalability for systems that demand large logic counts, substantial embedded RAM, and extensive I/O connectivity.

Key Features

• High Logic Capacity  Approximately 622,000 logic elements to implement large, complex digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM for buffering, packet processing, and state storage.
• Logic Fabric Scale  234,720 LABs/CLBs (family layout metric) to organize and map high‑density logic and routing.
• Abundant I/O  432 I/O pins to support wide parallel interfaces, multi‑lane connectivity, and diverse I/O standards (package I/O count as specified).
• Power and Core Supply  Core operating voltage range of 820 mV to 880 mV for the device core supply requirements.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for commercial environments.
• Package and Mounting  1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35); surface mount mounting type.
• RoHS Compliant  Manufactured to comply with RoHS requirements.
• Series Transceiver Capability (Stratix V GX family)  Stratix V GX family transceivers are described in the device series documentation with transceiver speed grades up to 14.1 Gbps (series‑level capability described in the Stratix V device datasheet).

Typical Applications

• High‑density digital systems  Implement large custom logic blocks, datapaths, and state machines where extensive logic resources and embedded RAM are required.
• I/O‑intensive designs  Support systems that need many parallel interfaces or multiple high‑pin-count peripherals through its 432 I/O pins.
• Packet and data buffering  Use embedded RAM for buffering, queues, and line‑rate data handling in commercial networking or communications equipment.
• Prototyping and system integration  Leverage the device’s logic density and package options for prototyping high‑capacity FPGA designs in commercial product development.

Unique Advantages

• Large programmable fabric: Approximately 622,000 logic elements reduce the need to partition designs across multiple devices, simplifying board and system design.
• Significant on‑chip memory: Around 51.2 Mbits of embedded RAM enables local buffering and state retention without external memory for many use cases.
• Extensive I/O availability: 432 I/Os provide flexibility to interface with multiple peripherals, parallel buses, and multi‑lane I/O schemes.
• Commercial readiness: Rated for commercial temperature range (0 °C to 85 °C) and RoHS compliant to meet typical commercial product requirements.
• Compact, assembly‑friendly package: 1152‑ball FCBGA package in a 35×35 outline supports surface‑mount assembly for space‑constrained PCBs.

Why Choose 5SGXEA7K3F35C2LG?

5SGXEA7K3F35C2LG combines high logic density, substantial embedded memory, and a large I/O count in a single commercial‑grade Stratix V GX package. It is intended for designers who need a highly integrated FPGA solution to consolidate complex digital functions, reduce BOM complexity, and support I/O‑heavy applications.

This device suits teams developing commercial electronics that require scalability and robust on‑chip resources. The Stratix V series documentation provides further series‑level capabilities for transceivers and speed grades to inform system‑level planning and integration.

If you would like pricing, availability, or technical procurement details for 5SGXEA7K3F35C2LG, submit a request for a quote or pricing inquiry to evaluate this Stratix V GX FPGA for your design.