5SGXEA7K3F35C2N

The 5SGXEA7K3F35C2N is a Stratix V GX family FPGA from Intel, offered in a high-density GX device configuration. It provides a large quantity of programmable logic, on-chip memory, and extensive I/O capability in a compact FBGA package.

Engineered for designs that require substantial logic capacity, plentiful embedded memory, and broad I/O, this commercial-grade device addresses applications where integration and high gate count are key design drivers.

Key Features

• High logic capacity — 622,000 logic elements to implement complex logic, parallel datapaths, and deep pipelined architectures.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• Extensive I/O — 432 user I/O pins to support broad external interfacing and multi-channel connectivity.
• Package and mounting — Surface-mount 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35) for compact system integration.
• Core voltage — Rated operating supply range from 870 mV to 930 mV.
• Commercial temperature grade — Operating range 0 °C to 85 °C for standard commercial applications.
• Stratix V GX family capabilities — Device-level datasheet documents Stratix V GX switching characteristics and transceiver options applicable to this family.
• Regulatory status — RoHS compliant.

Typical Applications

• High-performance signal processing — Large logic capacity and substantial embedded RAM enable complex DSP pipelines and real-time data handling.
• High-speed communications and transceiver systems — Stratix V GX family transceiver options and abundant I/O support multi-channel, high-bandwidth interfaces.
• Network and infrastructure accelerators — Dense logic and memory resources suit packet processing, protocol offload, and hardware acceleration functions.

Unique Advantages

• Significant on-chip resources: 622,000 logic elements paired with ~51.2 Mbits of embedded memory reduce the need for external components and simplify board design.
• Broad interfacing capability: 432 I/O pins allow flexible connection schemes for multi-channel and parallel I/O requirements.
• Compact, production-ready package: 1152-BBGA (35×35) FCBGA offers a high-density footprint suitable for space-constrained system boards.
• Commercial-grade operating window: 0 °C to 85 °C grade supports standard commercial deployments while aligning with typical production environments.
• Documented family-level performance: Stratix V GX device datasheet provides the electrical and switching characteristics needed for integration and timing analysis.

Why Choose 5SGXEA7K3F35C2N?

The 5SGXEA7K3F35C2N delivers a high-capacity FPGA architecture from the Stratix V GX family with a balanced combination of logic elements, embedded memory, and extensive I/O in a compact FBGA package. Its commercial-grade rating and documented electrical characteristics make it a pragmatic choice for teams implementing compute-intensive, high-bandwidth designs.

Engineers selecting this device benefit from Intel's Stratix V GX platform documentation and a parts profile that supports integration into systems demanding dense logic, ample on-chip RAM, and multiple external interfaces.

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