5SGXEA7K3F35C3

The 5SGXEA7K3F35C3 is a Stratix V GX family FPGA from Intel, delivering a high-density programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of embedded memory. It provides abundant I/O and a high-pin-count BGA package to address complex, logic‑intensive designs.

Built for commercial-temperature systems, this surface-mount FCBGA device combines large on-chip memory, extensive I/O (432 pins), and a low-voltage core supply range (820 mV to 880 mV) to support designs that require dense logic integration and substantial connectivity.

Key Features

• Logic Capacity  622,000 logic elements for implementing large-scale digital logic, state machines, and custom accelerators.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to store buffers, FIFOs, and intermediate data for high-throughput processing.
• I/O Count  432 general-purpose I/O pins to support broad interfacing requirements and multi-channel connectivity.
• Power and Core Voltage  Core supply range of 820 mV to 880 mV to match system power-rail design constraints.
• Package and Mounting  1152-BBGA (FCBGA) package, supplied as 1152-FBGA (35×35), in a surface-mount form factor for compact, high-pin-count board layouts.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard industrial/commercial environments.
• RoHS Compliance  RoHS-compliant component for conformity with lead-free and hazardous-substance restrictions.
• Series-Level Transceiver Capability  Stratix V GX family documentation describes transceiver speed grades used across the series (series-level information included in the device datasheet).

Typical Applications

• High-density digital signal processing  Leverage the large logic capacity and on-chip RAM for DSP pipelines, filters, and accelerator blocks.
• Networking and communications  Use the high I/O count and Stratix V GX family transceiver capabilities for multi‑lane packet processing and interface bridging.
• Compute acceleration and custom logic  Implement hardware accelerators and offload functions that demand significant logic and memory resources.
• System integration and prototyping  Support complex prototypes and system‑level integration where dense logic, numerous I/Os, and embedded memory are required.

Unique Advantages

• High logic density:  622,000 logic elements provide headroom for substantial custom logic and parallel processing architectures.
• Substantial embedded memory:  Approximately 51.2 Mbits of RAM reduces external memory dependence and improves data-path performance.
• Extensive I/O connectivity:  432 I/O pins enable multiple interfaces, parallel buses, and broad system interconnect options.
• Compact, high-pin-count package:  1152-BBGA (35×35) FCBGA packaging balances high pin density with a surface-mount footprint for space-constrained designs.
• Commercial-grade readiness:  0 °C to 85 °C operating range and RoHS compliance align the device with standard commercial production environments and regulatory requirements.

Why Choose 5SGXEA7K3F35C3?

The 5SGXEA7K3F35C3 positions itself as a high-capacity Stratix V GX FPGA option for designs that require large programmable logic, significant on-chip memory, and broad I/O resources in a compact BGA package. Its commercial temperature rating and RoHS compliance make it suitable for mainstream industrial and commercial systems.

Design teams targeting dense logic implementations, hardware acceleration, or multi-interface integration will find the device’s combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 432 I/O pins useful for reducing external component count and consolidating functionality on a single FPGA platform.

Request a quote or submit an inquiry to obtain pricing and availability for 5SGXEA7K3F35C3 and to evaluate it for your next high-density FPGA design.