5SGXEA7K3F35C3N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA

Quantity 299 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K3F35C3N – Stratix® V GX FPGA IC, 622,000 logic elements

The 5SGXEA7K3F35C3N is a Stratix V GX field programmable gate array (FPGA) from Intel, supplied in a 1152‑BBGA FCBGA package. This commercial‑grade device integrates a large logic fabric and substantial on‑chip memory for demanding digital designs.

Datasheet coverage for the Stratix V family includes electrical and switching characteristics, operating conditions, and power parameters relevant to device selection and system integration.

Key Features

  • Logic Capacity  622,000 logic elements (cells) to implement complex custom hardware functions and large‑scale digital logic.
  • Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support buffering, lookup tables, and memory‑intensive algorithms.
  • I/O Count  432 programmable I/O pins for broad interface flexibility with external peripherals and subsystems.
  • Package & Mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35×35), designed for surface‑mount assembly.
  • Power Supply  Core voltage supply range 820 mV to 880 mV, enabling precise power budgeting in system design.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation consistent with commercial‑grade applications.
  • Regulatory Compliance  RoHS compliant to support environmentally conscious product builds.

Unique Advantages

  • High logic integration: 622,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
  • Large on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports data buffering and local storage to improve system throughput.
  • Extensive I/O reach: 432 I/O pins provide connectivity options for diverse interfaces without external multiplexing.
  • Dense BGA package: 1152‑BBGA (35×35) package balances high pin count with a compact footprint for space‑constrained designs.
  • Commercial suitability: Rated for 0 °C to 85 °C, aligning the device with mainstream commercial electronics and consumer products.
  • Standards‑aware supply chain: RoHS compliance helps meet environmental requirements in manufacturing and distribution.

Why Choose 5SGXEA7K3F35C3N?

This Stratix V GX device positions itself where significant logic density, substantial embedded memory, and a high I/O count are required within a commercial temperature envelope. It is appropriate for design teams seeking a single FPGA platform capable of hosting large digital designs while maintaining a compact BGA footprint and documented electrical/switching characteristics in the Stratix V device datasheet.

Choosing this part supports scalability within the Stratix V family and provides engineers with verifiable device parameters—logic elements, memory, I/O, package, supply range, and operating temperature—for confident system integration and procurement.

Request a quote or submit a procurement inquiry to obtain availability and pricing for 5SGXEA7K3F35C3N. Provide part number and required quantities to receive a formal quote.

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