5SGXEA7K3F35C4N

The 5SGXEA7K3F35C4N is a Stratix V GX family FPGA in a 1152-BBGA FCBGA package, designed for commercial-temperature applications. It provides high logic density, substantial on-chip memory, and a large I/O count for complex digital designs.

Key on-device resources include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 432 I/O pins. The device is RoHS compliant, surface-mount packaged, and specified for operation from 0 °C to 85 °C with a core supply range of 820 mV to 880 mV.

Key Features

• Core Logic — 622,000 logic elements for implementing large-scale programmable logic and custom processing pipelines.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage without external memory.
• I/O Capacity — 432 user I/O pins enabling wide parallel interfaces and dense system connectivity.
• Package & Mounting — 1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA (35×35 mm) for compact, high-density board designs.
• Power — Core supply specified between 820 mV and 880 mV to match system power budgeting and regulator design.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for typical commercial environments.
• Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density digital processing — Use the large logic element count and embedded memory to implement complex custom logic, signal processing, and data-path acceleration.
• Multi‑interface systems — 432 I/Os enable interfacing to multiple peripherals, sensors, and parallel buses in communication and control systems.
• Prototyping and system integration — The device’s capacity and packaging suit breadboarding into advanced prototypes and high-density production boards.

Unique Advantages

• High programmable density: 622,000 logic elements provide the capacity needed for large-scale logic integration and complex custom functions.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory, simplifying BOM and improving data throughput.
• Extensive I/O resources: 432 I/Os allow flexible interface choices and parallel connectivity for demanding system-level designs.
• Compact, production-ready package: 1152-BBGA (1152-FBGA, 35×35) supports high-density PCB layouts and surface-mount assembly processes.
• Commercial-grade operating range: Rated 0 °C to 85 °C for deployment in standard commercial environments while remaining RoHS compliant.
• Defined core supply range: 820 mV–880 mV specification supports consistent power design and regulator selection.

Why Choose 5SGXEA7K3F35C4N?

This Stratix V GX FPGA balances high logic capacity, ample embedded memory, and substantial I/O in a single commercial-temperature, surface-mount package. It is well suited for designs that require dense programmable logic, on-chip data storage, and broad connectivity, while meeting RoHS requirements.

Engineers and procurement teams seeking scalable FPGA resources for complex digital systems will find this device appropriate for high-density integration, prototype development, and production deployments within commercial temperature environments.

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