5SGXEA7K3F35I3L
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 901 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7K3F35I3L – Stratix V GX FPGA, 622,000 logic elements, 1152-BBGA
The 5SGXEA7K3F35I3L is a Stratix® V GX field programmable gate array (FPGA) in an industrial-grade surface-mount 1152-BBGA package. It combines high logic density and large embedded memory with extensive I/O to address complex digital designs that require large programmable fabric and robust system integration.
Designed as part of the Stratix V GX family, the device is described in the family datasheet with detailed electrical and switching characteristics, including transceiver and I/O timing parameters. The 5SGXEA7K3F35I3L is positioned for applications that need high logic capacity, significant on-chip RAM, and broad I/O connectivity within an industrial temperature envelope.
Key Features
- Core Logic Provides 622,000 logic elements for implementing large-scale programmable logic and complex control/state machines.
- Embedded Memory Includes approximately 51.2 Mbits of on-chip RAM to support buffering, frame storage, and data-path parallelism.
- I/O Capacity 432 general-purpose I/O pins enable extensive external interfacing for sensors, peripherals, and high-pin-count system designs.
- Package & Mounting Supplied in a 1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35×35) for high-density board integration; surface-mount mounting type.
- Power Core supply range specified at 820 mV to 880 mV, allowing precise power planning for the programmable fabric.
- Temperature & Grade Industrial-grade device with an operating temperature range from –40°C to 100°C for reliable operation in demanding environments.
- Series Technical Coverage The Stratix V device datasheet documents electrical and switching characteristics for the family, including transceiver specifications, core/periphery performance, and programmable I/O timing.
- RoHS Compliance Device is RoHS-compliant for environmental and regulatory consideration.
Typical Applications
- High-density digital systems – Implement large-scale custom logic, complex state machines, and wide datapaths leveraging 622,000 logic elements and substantial on-chip RAM.
- High-speed communications – Use the Stratix V GX family’s transceiver-capable architecture and abundant I/O for serial interfaces and multi-lane links in networking equipment.
- Signal processing and data aggregation – On-chip memory and extensive logic resources support buffering, parallel processing, and protocol handling for data-centric designs.
- Industrial control and automation – Industrial temperature rating and robust packaging make the device suitable for control systems requiring deterministic logic and large I/O counts.
Unique Advantages
- High logic capacity: 622,000 logic elements enable integration of large, complex functions into a single FPGA, reducing board-level complexity.
- Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM support deep buffering and high-throughput data paths without external memory dependence.
- Extensive I/O connectivity: 432 I/Os provide flexible interfacing options for dense peripheral and interconnect requirements.
- Industrial-grade operation: Rated from –40°C to 100°C to meet temperature demands of industrial deployments.
- Compact, high-density package: 1152-BBGA (35×35 supplier package) enables high pin-count in a space-efficient form factor suitable for complex PCBs.
- Family-level technical documentation: Stratix V GX datasheet coverage of electrical, switching, and transceiver characteristics supports architecture-level design and verification.
Why Choose 5SGXEA7K3F35I3L?
The 5SGXEA7K3F35I3L delivers a combination of large programmable fabric, significant embedded memory, and high I/O density within an industrial-grade Stratix V GX FPGA package. It is well suited to engineers designing high-density digital systems, communication interfaces, and industrial control platforms that require integrated logic, on-chip RAM, and robust temperature performance.
Choosing this device provides a scalable, well-documented FPGA platform that supports complex implementations and system consolidation while enabling precise power and thermal planning thanks to its specified supply and operating range.
Request a quote or submit an inquiry to evaluate 5SGXEA7K3F35I3L for your next design and receive pricing and availability information tailored to your requirements.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018