5SGXEA7K3F35I3LN

The 5SGXEA7K3F35I3LN is a Stratix V GX field programmable gate array (FPGA) IC from Intel designed for high-density digital designs. It provides 622,000 logic elements and approximately 51.2 Mbits of embedded RAM, delivering substantial on-chip logic and memory resources in a single device.

Built for industrial environments, this device is specified for surface-mount assembly in a 1152-BBGA (FCBGA) package and rated for operation from −40 °C to 100 °C. The device operates from a core voltage supply range of 820 mV to 880 mV and includes 432 I/O pins for multi-interface designs.

Key Features

• Logic Capacity 622,000 logic elements suitable for complex digital implementations and large-scale RTL integration.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM for buffering, on-chip data storage, and algorithmic state.
• I/O Density 432 I/O pins to support multiple parallel interfaces, board-level connectivity, and mixed-signal front-end routing.
• Package & Mounting 1152-BBGA, FCBGA supplier device package (1152-FBGA (35x35)) optimized for surface-mount PCB assembly.
• Industrial Grade & Temperature Range Industrial grade device specified for operation from −40 °C to 100 °C for extended-temperature applications.
• Low-Voltage Core Core supply range of 820 mV to 880 mV to match system power-rail design requirements.
• Series Transceiver Capability (series-level) Stratix V GX series transceiver speed grades include GX channel rates up to 14.1 Gbps, depending on the device speed grade.
• Compliance RoHS-compliant to meet standard environmental restrictions for electronic assemblies.

Typical Applications

• Industrial Control and Automation The industrial temperature rating (−40 °C to 100 °C) and high logic density support robust control, signal processing, and sequencer implementations in industrial systems.
• Complex Digital Systems Large logic and embedded RAM resources make the device suitable for dense RTL designs, protocol bridging, and algorithm acceleration within FPGA-based systems.
• High I/O, Multi‑Interface Boards 432 I/Os in a compact 1152-BBGA package enable designs that require multiple parallel interfaces, board-level expansion, or mezzanine connectivity.

Unique Advantages

• High integration of logic and memory: 622,000 logic elements combined with ~51.2 Mbits of embedded RAM reduce the need for external components and simplify system architecture.
• Industrial temperature rating: Rated for −40 °C to 100 °C to support deployments in extended-temperature environments.
• Robust I/O capability: 432 I/Os provide flexibility for interfacing to diverse peripherals and high-density board layouts.
• Compact BGA packaging: 1152-BBGA (1152-FBGA (35x35)) enables high-density placement on surface-mount PCBs while keeping a small board footprint.
• Low-voltage core operation: 820–880 mV core supply supports power-rail planning for modern FPGA-based systems.
• RoHS-compliant: Meets environmental compliance expectations for electronic manufacturing.

Why Choose 5SGXEA7K3F35I3LN?

The 5SGXEA7K3F35I3LN positions itself as a high-density, industrial-grade Stratix V GX FPGA option that combines a large logic fabric with substantial on-chip RAM and extensive I/O. Its 1152-BBGA package and surface-mount form factor facilitate compact board designs while supporting demanding thermal ranges and low-voltage core requirements.

This device is appropriate for design teams requiring substantial programmable logic and memory resources in industrial environments, and for projects that demand many I/Os and a compact BGA footprint. The series-level transceiver capabilities and Intel Stratix V family heritage provide a clear migration path for designs that may leverage different speed grades within the same device family.

Request a quote or submit an inquiry to get pricing and availability for the 5SGXEA7K3F35I3LN and to discuss how it fits your next FPGA-based design.