5SGXEA7K3F35I3LG

The 5SGXEA7K3F35I3LG is a high-density Stratix V GX field programmable gate array (FPGA) from Intel, offered in an industrial temperature grade. It integrates a large logic fabric and substantial on-chip memory with abundant I/O in a compact 1152-ball FCBGA package, suitable for advanced system designs that require high resource density and robust operating range.

Device documentation for the Stratix V family covers electrical and switching characteristics, including I/O timing and transceiver specifications for the series, supporting detailed design and system integration work.

Key Features

• Logic Capacity  Approximately 622,000 logic elements for implementing complex digital functions and large-scale programmable logic designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support data buffering, FIFOs, and large state storage without external memory.
• I/O Resources  432 I/O pins to support wide parallel interfaces, multiple peripherals, and extensive board-level connectivity.
• Power Supply  Core voltage operation specified from 820 mV to 880 mV to match system power-rail designs and core power budgeting.
• Package & Mounting  1152-BBGA (FCBGA), supplier package 1152-FBGA (35×35); surface-mount package suitable for compact, high-density PCB layouts.
• Temperature & Grade  Industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in extended-temperature environments.
• Compliance  RoHS compliant.
• Series-Level Documentation  Stratix V device datasheet provides electrical and switching characteristics, I/O timing, and transceiver information for system-level design reference.

Unique Advantages

• High logic density: Large logic element count enables implementation of complex algorithms and multiple parallel functions on a single device, reducing board-level part count.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM minimizes dependence on external memory for many buffering and storage needs.
• Extensive I/O capability: 432 I/O pins provide flexibility for interfacing to wide buses, multi-lane peripherals, and high-pin-count system architectures.
• Industrial temperature range: Rated from –40 °C to 100 °C to support designs intended for extended-temperature applications.
• Compact, manufacturable package: 1152-ball FCBGA surface-mount package (35×35) supports dense PCB routing and reliable assembly processes.
• Defined core operating window: Core supply specified at 820–880 mV simplifies power design and core voltage provisioning in the system.

Why Choose 5SGXEA7K3F35I3LG?

5SGXEA7K3F35I3LG positions itself as a high-resource Stratix V GX FPGA option for designs that require significant logic capacity, large embedded memory, and plentiful I/O in a single, industrial-grade device. Its combination of ~622k logic elements, ~51.2 Mbits of on-chip RAM, and 432 I/O make it well suited to complex digital signal processing, protocol bridging, or large programmable subsystems where integration and density matter.

Backed by the Stratix V family documentation, the device provides clear electrical and switching characteristics to support engineering validation and system integration. The 1152-ball FCBGA package and defined operating voltage and temperature ranges help teams design for manufacturability and reliability in extended-temperature environments.

Request a quote or submit an inquiry to purchase 5SGXEA7K3F35I3LG for your next high-density FPGA design project.