5SGXEA7K3F35C4G

The 5SGXEA7K3F35C4G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1152-ball FCBGA package. It provides high logic density, abundant embedded RAM, and a large I/O count for complex, highly integrated digital designs.

Designed as a commercial-grade device, this FPGA targets designs that require significant on-chip logic, substantial embedded memory, and extensive connectivity while operating within a 0 °C to 85 °C temperature range and a core supply range of 820 mV to 880 mV.

Key Features

• Logic Capacity  Provides 622,000 logic elements for large-scale custom logic and compute implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, LUTs, and memory-intensive functions without external RAM.
• I/O Count  432 user I/O pins to support extensive peripheral and board-level connectivity.
• Power and Voltage  Core supply voltage range specified at 820 mV to 880 mV for core power planning and board design.
• Package & Mounting  1152-ball FCBGA (35 × 35 mm) surface-mount package for compact, high-density board integration.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial-environment deployments.
• RoHS Compliant  Manufactured to meet RoHS environmental compliance requirements.

Typical Applications

• High-density programmable logic  Implement large custom digital functions and complex state machines using the device’s substantial logic element count.
• Memory-intensive designs  Leverage approximately 51.2 Mbits of embedded RAM for buffering, packet handling, and on-chip data storage.
• Connectivity and I/O expansion  Support systems requiring many external interfaces or parallel I/O with 432 available I/O pins.

Unique Advantages

• High integration in a single device: Combines 622,000 logic elements and large embedded RAM to reduce the need for multiple discrete components.
• Extensive I/O availability: 432 I/O pins enable complex board-level interfacing and flexible system partitioning.
• Compact BGA footprint: 1152-ball FCBGA package provides a high pin-count solution in a compact form factor for dense PCB layouts.
• Commercial temperature support: Rated 0 °C to 85 °C to meet standard commercial deployment requirements.
• Clear electrical envelope: Documented core voltage range (820 mV–880 mV) simplifies power-supply design and validation.

Why Choose 5SGXEA7K3F35C4G?

The 5SGXEA7K3F35C4G delivers a combination of high logic density, significant on-chip memory, and broad I/O capacity in a single, commercial-grade Stratix V GX FPGA. These characteristics make it well suited for designs that require dense programmable logic and extensive on-chip resources while maintaining a compact board footprint.

As part of the Stratix V family, the device is supported by published device documentation and electrical characteristics that aid system design, power budgeting, and thermal planning. It is a practical choice for engineering teams and procurement looking for a high-capacity FPGA with verifiable specifications.

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