5SGXEA7K3F35I3G

The 5SGXEA7K3F35I3G is a Stratix V GX Field Programmable Gate Array (FPGA) device offering high on-chip density and extensive I/O in a ball-grid array package. Its specifications include 622,000 logic elements (cells), approximately 51.2 Mbits of embedded memory, 432 I/Os, and industrial-grade operation rated from −40 °C to 100 °C.

This device is suited to systems requiring large programmable logic capacity, substantial embedded RAM, and robust I/O counts while operating within the specified industrial temperature and supply-voltage windows.

Key Features

• Core Density 622,000 logic elements (cells) provide large programmable logic capacity for complex digital designs.
• On-chip Memory Approximately 51.2 Mbits of embedded memory to support large buffering, state storage, and on-chip data structures.
• I/O Capability 432 user I/Os to accommodate wide buses, multiple interfaces, and heavy external connectivity.
• Power Supply Core supply rated between 820 mV and 880 mV to match the device’s specified operating voltage window.
• Package & Mounting 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA (35x35)) with surface-mount mounting for high-density PCB assembly.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, enabling deployment in temperature-challenging environments.
• Standards & Compliance RoHS compliant, reflecting adherence to restricted substances requirements.

Typical Applications

• High-density digital systems Designs that require extensive logic capacity and on-chip memory can leverage the device’s 622,000 logic elements and ~51.2 Mbits of embedded RAM.
• I/O‑intensive applications Systems needing numerous external connections use the device’s 432 I/Os for wide parallel interfaces and multi-channel I/O.
• Industrial equipment Industrial systems benefit from the device’s industrial-grade rating and −40 °C to 100 °C operating range for reliable field operation.

Unique Advantages

• Large programmable fabric: 622,000 logic elements (cells) enable complex logic integration and combinational/sequential resources on a single device.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
• Extensive external connectivity: 432 I/Os simplify board-level routing by supporting multiple interfaces and parallel data paths without external multiplexing.
• Industrial-ready thermal range: Rated from −40 °C to 100 °C to support deployment in harsher ambient conditions where extended temperature capability is required.
• Compact, surface-mount packaging: 1152-BBGA / 1152-FBGA (35x35) packaging delivers high I/O density in a footprint suitable for modern PCB assembly processes.
• Regulatory compliance: RoHS compliance aligns the device with common environmental and procurement requirements.

Why Choose 5SGXEA7K3F35I3G?

As a member of the Stratix V GX family, the 5SGXEA7K3F35I3G combines a very large logic fabric, substantial embedded memory, and high I/O count in a single industrial-grade FPGA package. These characteristics make it appropriate for designers who need high-density programmable logic, generous on-chip RAM, and broad external connectivity while maintaining operation across an extended temperature range.

This device is well suited for electronic designs where integration density and robustness are important considerations, offering a balance of logic capacity, memory, I/O, and packaging for demanding industrial applications.

Request a quote or contact sales to discuss availability, pricing, and how the 5SGXEA7K3F35I3G can fit your next design.