5SGXEA7K3F35I3N

The 5SGXEA7K3F35I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It delivers a high-density programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of on-chip RAM, alongside 432 user I/Os and an advanced 1152-FBGA (35×35) package.

Designed for compute- and I/O-intensive designs, this device targets applications that require large logic capacity, substantial embedded memory, and robust industrial-temperature operation while operating from a core supply range of 0.82–0.88 V.

Key Features

• Core Logic  622,000 logic elements (cells) provide expansive programmable logic capacity for complex digital implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-centric algorithms.
• I/O Density  432 I/O pins enable broad connectivity for high-channel-count interfaces and mixed-signal front ends.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board integration.
• Power  Core voltage supply range of 820 mV to 880 mV, consistent with Stratix V GX device operating conditions.
• Temperature Grade  Industrial grade with specified operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Large logic capacity and industrial temperature rating support complex control algorithms, high-channel I/O, and factory automation implementations.
• Communications Infrastructure  High-density logic and abundant on-chip RAM enable protocol processing, packet buffering, and interface aggregation for telecom and data-center equipment.
• Signal Processing  Substantial logic and memory resources accommodate real-time signal processing pipelines, large FIR/IIR filters, and multi-channel data paths.

Unique Advantages

• High logic capacity: 622,000 logic elements allow implementation of complex, deeply pipelined designs without external offload.
• Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for buffering and state storage.
• Broad I/O availability: 432 I/Os give designers flexibility to connect multiple interfaces, sensors, or high-speed lanes directly to the FPGA.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in industrial and harsh-environment systems.
• Compact high-pin package: 1152-FBGA (35×35) provides a high-pin-count solution in a space-efficient surface-mount footprint.
• Standards-compliant supply range: Core voltage specified at 0.82–0.88 V for predictable power sequencing and system integration.

Why Choose 5SGXEA7K3F35I3N?

This Stratix V GX device balances large programmable logic capacity, substantial embedded memory, and high I/O density in a single industrial-grade FPGA. It is well suited to engineers building compute- and I/O-heavy systems that require reliable operation across a wide temperature range and a compact, high-pin-count package.

As a member of the Stratix V family, the 5SGXEA7K3F35I3N provides a scalable option for designs that need to migrate between densities and package options within the same device family while maintaining documented electrical and switching characteristics.

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