5SGXEA7K3F40C2G

The 5SGXEA7K3F40C2G is a Stratix V GX family FPGA from Intel, delivered in a 1517-BBGA FCBGA package. It provides high on-chip logic and memory capacity with extensive I/O and is offered in a commercial temperature grade for general-purpose embedded and programmable logic applications.

With a large logic element count and substantial embedded RAM, this device targets designs that require dense programmable logic, significant on-chip storage, and a high I/O pin count while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity  Approximately 622,000 logic elements for implementing complex, high-density logic designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffering, state machines, and data-path storage.
• I/O Resources  696 general-purpose I/O pins to support broad interfacing with external devices and high pin-count systems.
• Power and Core Supply  Core voltage supply range of 870 mV to 930 mV to match system power-rail requirements for this device.
• Package and Mounting  Supplied in a 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40); surface-mount mounting type for PCB integration.
• Temperature Grade  Commercial operating temperature range: 0 °C to 85 °C.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density programmable systems  Leverage ~622,000 logic elements and ~51.2 Mbits of embedded memory to implement sizable custom logic and datapath functions on a single device.
• Data buffering and on-chip storage  Use the substantial embedded RAM for large FIFOs, packet buffering, and intermediate storage in data-path applications.
• High-pin-count interfaces  Take advantage of 696 I/Os to connect to multiple peripherals, memory interfaces, or distributed I/O requirements on complex PCBs.

Unique Advantages

• High integration density: Combine hundreds of thousands of logic elements with tens of megabits of embedded RAM to reduce board-level component count.
• Extensive I/O capacity: 696 I/Os enable flexible system partitioning and support for multi-channel external interfaces without resorting to additional I/O expanders.
• Commercial-temperature operation: Rated for 0 °C to 85 °C, suitable for standard embedded and commercial applications.
• RoHS compliant: Conforms to RoHS requirements for environmentally conscious manufacturing and supply-chain compatibility.
• Surface-mount package: 1517-BBGA (supplier 1517-FBGA, 40×40) offers a compact footprint for high-density PCB layouts.
• Defined core supply window: 870 mV to 930 mV core supply range supports predictable power planning and thermal management in system design.

Why Choose 5SGXEA7K3F40C2G?

The 5SGXEA7K3F40C2G delivers a balance of large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact surface-mount FCBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of standard embedded designs that require dense on-chip resources and extensive external connectivity.

Backed by Intel’s Stratix V device documentation, this FPGA is appropriate for engineering teams building complex, high-density programmable logic solutions that demand integrated memory, many I/Os, and a clearly defined core power envelope for system-level power and thermal planning.

Request a quote or submit an inquiry to purchase or evaluate 5SGXEA7K3F40C2G for your next high-density FPGA design project.