5SGXEA7K3F40C2N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 140 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K3F40C2N – Stratix V GX FPGA, 622,000 logic elements; ~51.2 Mbits RAM; 696 I/Os

The 5SGXEA7K3F40C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1517-BBGA FCBGA package. It provides a high-density programmable logic fabric combined with substantial on-chip memory and a large number of I/O pins for complex, I/O‑intensive designs.

Targeted for commercial-grade applications, this device balances logic capacity, embedded RAM, and extensive I/O while operating within a low-voltage core range of 870 mV to 930 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity — 622,000 logic elements (LEs) to implement complex, high‑functionality designs.
  • Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM for buffering, state storage, and memory‑intensive functions.
  • Extensive I/O — 696 user I/O pins to support dense external interfacing and board‑level integration.
  • Transceiver Family Characteristics — Stratix V GX family documentation includes high‑speed transceiver options and I/O timing controls suitable for designs that require advanced serial interfaces (see family datasheet for transceiver speed grades).
  • Power and Voltage — Core supply range of 870 mV to 930 mV to match low‑voltage power architectures.
  • Package & Mounting — 1517‑BBGA FCBGA package (supplier package noted as 1517‑FBGA (40×40)), surface mount for compact, high‑density board layouts.
  • Commercial Grade & Compliance — Commercial temperature grade (0 °C to 85 °C) and RoHS‑compliant.

Typical Applications

  • High‑density programmable logic — Use the device where substantial logic capacity is required to implement custom digital functions and complex state machines, leveraging 622,000 logic elements.
  • Memory‑intensive designs — Embedded ~51.2 Mbits of RAM supports buffering, packet processing, or other on‑chip memory needs without external RAM for many functions.
  • I/O‑rich systems — The 696 I/Os accommodate multi‑lane interfaces, parallel peripherals, and board‑level connectivity in I/O‑dense applications.
  • High‑speed serial connectivity (family level) — Stratix V GX family transceiver options (as documented in the family datasheet) suit designs that require advanced serial link capabilities.

Unique Advantages

  • High logic density: 622,000 logic elements allow consolidation of multiple functions into a single device, reducing system complexity.
  • Substantial embedded memory: Approximately 51.2 Mbits of on‑chip RAM provides internal storage for buffering and state, lowering external memory requirements.
  • Large I/O complement: 696 I/Os enable broad connectivity options for multi‑interface systems and complex board routing.
  • Compact FCBGA package: 1517‑BBGA (supplier 1517‑FBGA, 40×40) supports high‑density board layouts while remaining surface mount compatible.
  • Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS‑compliant for standard commercial deployments.
  • Low core voltage: 870 mV to 930 mV core supply supports integration into low‑voltage power domains.

Why Choose 5SGXEA7K3F40C2N?

The 5SGXEA7K3F40C2N positions itself as a high‑capacity Stratix V GX FPGA for commercial designs that require large programmable logic resources, significant on‑chip memory, and extensive I/O. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 696 I/Os makes it suitable for consolidating multiple subsystems onto a single device and simplifying board-level architecture.

Backed by Intel’s Stratix V family documentation and available in a compact 1517‑BBGA FCBGA package, this device offers a balance of performance, integration, and board density for teams developing advanced digital systems within commercial temperature ranges.

Request a quote or submit a pricing inquiry to evaluate the 5SGXEA7K3F40C2N for your next design.

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