5SGXEA7K3F40C3

The 5SGXEA7K3F40C3 is a Stratix® V GX field-programmable gate array (FPGA) offered in a 1517-ball FCBGA package. It delivers a high-density programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of embedded RAM for designs that require large on-chip logic and memory resources.

With 696 user I/Os, a compact 1517-FBGA (40×40) package and a commercial operating temperature range, this device is suited to surface-mount applications that need significant logic capacity, dense I/O routing and low-voltage core operation.

Key Features

• Logic Capacity  622,000 logic elements provide a high-density programmable fabric for complex logic integration and system consolidation.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, packet queues or state storage directly in the FPGA fabric.
• I/O Density  696 user I/Os offer broad external connectivity for high-pin-count interfaces and multi-channel designs.
• Package and Mounting  1517-ball BGA (FCBGA) package, supplier package referenced as 1517-FBGA (40×40), designed for surface-mount PCB assembly.
• Power and Core Supply  Core supply voltage specified between 820 mV and 880 mV to match low-voltage FPGA power domains.
• Operating Grade and Temperature  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density logic integration  Use the large logic element count to consolidate multiple functions into a single programmable device.
• On-chip buffering and data handling  Approximately 51.2 Mbits of embedded RAM for buffering, packet storage or intermediate data processing.
• I/O-rich systems  696 I/Os enable designs requiring extensive external interfacing or parallel channel connectivity.

Unique Advantages

• High programmable capacity: 622,000 logic elements allow substantial logic integration and reduced need for multiple FPGAs.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM supports large data structures without external memory.
• Extensive I/O availability: 696 user I/Os simplify routing for multi-channel and multi-interface designs.
• Compact, surface-mount package: 1517-FBGA (40×40) footprint enables dense board layouts while maintaining mechanical robustness.
• Low-voltage core operation: 820 mV–880 mV core supply supports modern low-voltage power architectures.
• Commercial temperature grade: Rated 0 °C to 85 °C for applications targeting commercial environments.

Why Choose 5SGXEA7K3F40C3?

The 5SGXEA7K3F40C3 delivers a combination of large logic capacity, significant embedded memory and high I/O count in a compact FCBGA package, making it a strong choice for designs that need to consolidate functionality and handle substantial on-chip data. Its commercial-grade temperature rating and RoHS compliance support deployment in a wide range of surface-mount applications.

As a member of the Stratix V GX family, this device aligns with the device family specifications published in the Stratix V datasheet, enabling designers to reference family-level electrical and switching characteristics when planning system-level power and timing.

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