5SGXEA7K3F40C3W

The 5SGXEA7K3F40C3W is a Stratix V GX FPGA IC in a 1517-ball FCBGA package designed for commercial-grade applications. It provides a high-capacity programmable fabric with a large number of logic elements, substantial on-chip memory, and a high I/O count for complex digital designs.

This device targets designs that require dense logic integration and significant embedded memory while operating within a commercial temperature range. Key electrical and package characteristics include a supply voltage range of 820 mV to 880 mV, surface-mount packaging, and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core logic capacity — Approximately 622,000 logic elements to implement large-scale digital logic and complex algorithms.
• Fabric resources — 234,720 logic array blocks as reported for the device family, enabling granular placement of logic functions across the device.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions without external memory.
• I/O density — 696 I/O pins for extensive peripheral, sensor, and high-pin-count interface connectivity.
• Package — 1517-BBGA (FCBGA) supply package (supplier device package: 1517-FBGA, 40×40) suitable for high-pin-count board integration and surface-mount assembly.
• Power and operating range — Core supply range of 820 mV to 880 mV with commercial-grade operating temperature from 0 °C to 85 °C.
• Compliance and mounting — RoHS-compliant device with surface-mount package intended for commercial applications.
• Stratix V GX family characteristics — As a member of the Stratix V GX family, the device follows the family’s documented core and transceiver speed-grade offerings per the Stratix V device datasheet.

Typical Applications

• High-density digital systems — Use the device’s ~622k logic elements to implement complex state machines, signal processing pipelines, or hardware accelerators.
• Memory-intensive designs — Approximately 51.2 Mbits of embedded RAM is suitable for buffering, packet queues, and on-chip data storage to reduce external memory dependence.
• High-pin-count interfaces — With 696 I/Os and a 1517-ball FCBGA package, the device supports designs requiring many parallel interfaces and peripheral connections.

Unique Advantages

• High integration density: Large logic-element count enables consolidation of functions that would otherwise require multiple devices.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces the need for external memory and simplifies BOM and board routing.
• Extensive I/O capability: 696 I/Os provide flexibility for interfacing to a wide range of peripherals, sensors, and high-pin-count connectors.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation to meet standard commercial electronics environments.
• Compact FCBGA packaging: 1517-ball FCBGA (40×40) enables a high-pin-count footprint in a compact surface-mount form factor.
• Standards-based family documentation: Device parameters and speed-grade options are defined within the Stratix V device datasheet for design reference.

Why Choose 5SGXEA7K3F40C3W?

The 5SGXEA7K3F40C3W delivers a balanced combination of high logic density, extensive embedded memory, and large I/O capacity in a commercial-grade Stratix V GX FPGA package. It is well suited for designers who need to implement complex digital systems with significant on-chip resources while maintaining a compact board footprint.

For projects that demand scalability within the Stratix V family and clear specification-driven design, this device provides verifiable, high-capacity resources and documented operating parameters to support reliable integration into commercial electronic products.

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