5SGXEA7K3F40C4
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 24 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7K3F40C4 – Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 I/Os, ~51.2 Mbits RAM, 622,000 logic elements, 1517-BBGA
The 5SGXEA7K3F40C4 is a Stratix V GX field programmable gate array (FPGA) offered in a 1517-ball FCBGA package. This commercial-grade device combines high logic capacity, dense embedded memory, and a large I/O count to support complex, high-density digital designs.
Device documentation for the Stratix V family includes detailed electrical and switching characteristics, covering core and periphery performance, transceiver specifications, and I/O timing and delays—information useful for system-level integration and timing closure.
Key Features
- High Logic Capacity Provides 622,000 logic elements (cells) to implement large-scale digital functions and complex custom logic.
- Substantial Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and stored-state logic without immediate external memory dependence.
- Extensive I/O 696 user I/Os for high pin-count interfaces, enabling broad connectivity to peripherals, high-speed lanes, or parallel interfaces.
- Package and Mounting Delivered in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package for board-level integration in compact form factors.
- Power Supply Range Specified core voltage supply range of 820 mV to 880 mV for core power planning and regulator selection.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
- RoHS Compliant Manufactured to meet RoHS requirements for environmental compliance.
Typical Applications
- High-density digital systems Large logic capacity and extensive embedded RAM make the device suitable for complex FPGA designs requiring significant on-chip resources.
- Multi-channel I/O systems The 696 I/Os support designs that require numerous external interfaces, parallel buses, or multiple I/O standards (per system design requirements).
- Board-level integration in compact systems The 1517-BBGA surface-mount package supports high-density PCB layouts for space-constrained applications.
Unique Advantages
- Large on-chip resource pool: 622,000 logic elements plus approximately 51.2 Mbits of embedded memory reduce reliance on external logic and memory components.
- High I/O density: 696 I/Os allow designers to consolidate multiple interfaces and simplify routing for multi-peripheral systems.
- Compact package form: The 1517-FBGA (40×40) package offers a high-ball-count footprint for maximizing functionality in limited board area.
- Commercial-grade operating range: Rated 0 °C to 85 °C, matching typical commercial system environments and deployment scenarios.
- Documented electrical and timing data: Stratix V family datasheets provide electrical, switching, transceiver, and I/O timing characteristics to support detailed system design and verification.
- Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.
Why Choose 5SGXEA7K3F40C4?
The 5SGXEA7K3F40C4 is positioned for designs that require substantial on-chip logic, generous embedded memory, and a high number of I/Os in a compact BGA package. Its commercial-grade specification and documented electrical and switching characteristics help streamline system-level planning for timing, power, and I/O integration.
This device is suited to engineering teams building feature-dense, board-level FPGA solutions where consolidation of logic and memory resources on-chip can reduce BOM complexity and simplify PCB design while relying on vendor-provided device characterization for integration and validation.
Request a quote or submit a pricing inquiry to evaluate the 5SGXEA7K3F40C4 for your next FPGA-based design.

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