5SGXEA7K3F40C4

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 24 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K3F40C4 – Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 I/Os, ~51.2 Mbits RAM, 622,000 logic elements, 1517-BBGA

The 5SGXEA7K3F40C4 is a Stratix V GX field programmable gate array (FPGA) offered in a 1517-ball FCBGA package. This commercial-grade device combines high logic capacity, dense embedded memory, and a large I/O count to support complex, high-density digital designs.

Device documentation for the Stratix V family includes detailed electrical and switching characteristics, covering core and periphery performance, transceiver specifications, and I/O timing and delays—information useful for system-level integration and timing closure.

Key Features

  • High Logic Capacity  Provides 622,000 logic elements (cells) to implement large-scale digital functions and complex custom logic.
  • Substantial Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and stored-state logic without immediate external memory dependence.
  • Extensive I/O  696 user I/Os for high pin-count interfaces, enabling broad connectivity to peripherals, high-speed lanes, or parallel interfaces.
  • Package and Mounting  Delivered in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package for board-level integration in compact form factors.
  • Power Supply Range  Specified core voltage supply range of 820 mV to 880 mV for core power planning and regulator selection.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
  • RoHS Compliant  Manufactured to meet RoHS requirements for environmental compliance.

Typical Applications

  • High-density digital systems  Large logic capacity and extensive embedded RAM make the device suitable for complex FPGA designs requiring significant on-chip resources.
  • Multi-channel I/O systems  The 696 I/Os support designs that require numerous external interfaces, parallel buses, or multiple I/O standards (per system design requirements).
  • Board-level integration in compact systems  The 1517-BBGA surface-mount package supports high-density PCB layouts for space-constrained applications.

Unique Advantages

  • Large on-chip resource pool: 622,000 logic elements plus approximately 51.2 Mbits of embedded memory reduce reliance on external logic and memory components.
  • High I/O density: 696 I/Os allow designers to consolidate multiple interfaces and simplify routing for multi-peripheral systems.
  • Compact package form: The 1517-FBGA (40×40) package offers a high-ball-count footprint for maximizing functionality in limited board area.
  • Commercial-grade operating range: Rated 0 °C to 85 °C, matching typical commercial system environments and deployment scenarios.
  • Documented electrical and timing data: Stratix V family datasheets provide electrical, switching, transceiver, and I/O timing characteristics to support detailed system design and verification.
  • Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose 5SGXEA7K3F40C4?

The 5SGXEA7K3F40C4 is positioned for designs that require substantial on-chip logic, generous embedded memory, and a high number of I/Os in a compact BGA package. Its commercial-grade specification and documented electrical and switching characteristics help streamline system-level planning for timing, power, and I/O integration.

This device is suited to engineering teams building feature-dense, board-level FPGA solutions where consolidation of logic and memory resources on-chip can reduce BOM complexity and simplify PCB design while relying on vendor-provided device characterization for integration and validation.

Request a quote or submit a pricing inquiry to evaluate the 5SGXEA7K3F40C4 for your next FPGA-based design.

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