5SGXEA7K3F40C4WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,461 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7K3F40C4WN – Stratix® V GX FPGA, 622,000 logic elements, approximately 51 Mbits RAM, 696 I/Os, 1517‑BBGA FCBGA
The 5SGXEA7K3F40C4WN is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1517‑BBGA FCBGA package. It combines high logic capacity, substantial embedded memory, and a large I/O count in a surface‑mount FBGA footprint for commercial‑temperature applications.
With 622,000 logic elements, approximately 51 Mbits of embedded memory and 696 general‑purpose I/Os, this device is aimed at designs that require dense programmable logic, significant on‑chip RAM, and extensive I/O connectivity while operating within a 0 °C to 85 °C commercial temperature range and a core supply of 0.820 V to 0.880 V.
Key Features
- Core Architecture Stratix V GX FPGA family device — field‑programmable logic fabric for customizable digital designs.
- Logic Capacity 622,000 logic elements to implement complex state machines, datapaths, and control logic.
- Embedded Memory Approximately 51 Mbits of on‑chip RAM to support buffering, lookup tables, and on‑chip data storage.
- I/O Resources 696 I/Os providing extensive connectivity options for parallel and serialized interfaces.
- Power and Core Voltage Core supply range of 0.820 V to 0.880 V to match low‑voltage system architectures.
- Package and Mounting 1517‑BBGA (1517‑FBGA, 40×40) surface‑mount package for high‑density board implementations.
- Operating Grade Commercial grade device rated for 0 °C to 85 °C ambient operation.
- RoHS Compliance RoHS‑compliant to support environmentally responsible designs.
Typical Applications
- Communications and Networking High-density logic and large I/O counts accommodate protocol processing, packet handling, and custom interface implementations.
- High‑Density Digital Processing Substantial logic and embedded memory enable complex datapaths, algorithm acceleration, and custom compute pipelines.
- Signal and Video Processing Embedded RAM and extensive I/O make the device suitable for buffering, frame processing, and real‑time data handling.
- Test, Measurement and Prototyping Programmable fabric with abundant I/Os supports instrumentation, custom test logic, and design validation platforms.
Unique Advantages
- High integration of programmable logic: 622,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system complexity.
- Substantial on‑chip memory: Approximately 51 Mbits of embedded RAM minimizes external memory dependence for many buffering and lookup needs.
- Extensive I/O capacity: 696 I/Os support multiple parallel interfaces and I/O‑heavy designs without immediate need for external expanders.
- Low‑voltage core operation: 0.820 V to 0.880 V core supply supports low‑voltage system power architectures.
- Compact FBGA packaging: 1517‑BBGA (1517‑FBGA, 40×40) surface‑mount package allows high‑density placement on standard PCBs.
- Commercial temperature rating: Rated for 0 °C to 85 °C operation for mainstream commercial deployments.
Why Choose 5SGXEA7K3F40C4WN?
The 5SGXEA7K3F40C4WN balances high logic density, significant embedded memory, and broad I/O resources in a compact FBGA package for commercial applications. It is well suited to designers who need a programmable platform capable of implementing complex digital systems while minimizing external components.
For teams focused on communications, signal processing, high‑density computation, or advanced prototyping, this Stratix V GX device provides a scalable, integrated foundation backed by Intel’s Stratix V family documentation and support resources.
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